Luminous Intensity
A unit for measuring light. Unit: cd (Candela)
Luminous Flux
A unit for measuring light. Unit: lm (Lumen)
Luminance Efficiency
Amount of light (lumens) discharged per unit power (1W) applied.
Silicon
An element with semiconductor properties, and the principal ingredient of silicon wafers.
Nano
A unit used to measure semiconductor circuit width. One nanometer is one billionth of a meter.
NAND Flash Memory
A type of flash memory where semiconductor cells are arranged serially.
Data storage methods of NAND flash memory
Storage devices such as memory cards, USB thumb drives, and SSDs use NAND flash memory to store data. NAND flash is categorized as SLC, MLC, TLC, or QLC depending on the method of data storage.
Stepper Exposure
A process in which light is projected through a mask to draw circuits onto a wafer.
NOR Flash Memory
A type of flash memory where semiconductor cells are arranged in parallel.
Diode
A semiconductor element with rectifying and light-emitting characteristics. Made of germanium or silicon.
LGP, Light Guide Plate
A component that regulates the brightness of a BLU (back light unit) and keeps lighting uniform.
Conductor
A material through which electricity or heat flows well. Examples include gold (Au), silver (Ag), copper (Cu), and aluminum (Al).
RAM (Random Access Memory)
Memory that records data, where recorded data can be read or modified.
ROM (Read Only Memory)
Memory where recorded data can be read, but not modified.
Lead Frame
A metal matrix which functions as the lead connecting a semiconductor chip with an outside circuit, and as a frame for fixing a semiconductor package to a board.
Mask
A glass sheet on which microscopic electronic circuits are drawn, used in the photolithography step of semiconductor integrated circuit manufacturing.
Machine Learning
A technology by which a machine gathers and analyzes empirical data to improve its own performance.
Memory Semiconductor
A semiconductor used for storing data.
Mobile Application Processor
A system semiconductor installed in electronic devices such as smart phones and tablet PCs, functioning as a brain to carry out command interpretation, computation and control, etc.
Mobile DRAM
A memory semiconductor used to operate mobile devices.
Mid·High-Power LED Package
High-power LED packages generally exceed 1W (watt) in power consumption; LED packages with less than 1W in power consumption are called mid-power LED packages.
Semiconductor
A material whose electrical conductivity is between that of a conductor and an insulator.
Insulator
A material through which electricity or heat cannot easily pass through.
Units of Light
Luminous intensity (cd), luminous flux (lm), intensity of illumination (lux), brightness (nit), luminance efficiency (lm/W).
Oxide Film
A film protecting a silicon surface from impurities occurring in-process.
Color Temperature
A method of expressing the light from a light source. Expressed in K (Kelvin) units.
Color Gamut
A numerical value expressing a display’s ability to express color.
Cleaning
A process by which impurities on a wafer surface area are removed through chemical treatment, gas, or physical methods.
Yield
In semiconductors, yield is the percentage of products without defects passing inspection.
Smart Card
A semiconductor integrated circuit with various functions embedded in a plastic card.
Stack Method
A technology wherein integration is enhanced by stacking multiple layers of cells in a semiconductor chip.
System Semiconductor
Semiconductors that perform logical, computation, and control functions, etc.
Etching
A process in which parts other than the necessary circuit pattern are removed from a wafer.
Neural Processing Unit (NPU)
A processor that learns and processes data like the human brain.
ISOCELL
A new technology that uses physical barriers between pixels of a CMOS image sensor to reduce optical loss and interference, overcoming performance limitations.
Quantum Efficiency
The percentage by which photons or electrons in a material are converted into photons or electrons of a different energy.
Color Rendering Index
One of the properties of a light source. Expressed in CRI units.
Wafer
The key material used to create semiconductor integrated circuits. A thin and round sheet obtained by slicing a monocrystalline ingot obtained by growing silicon (Si) and gallium arsenide (GaAs), etc.
Image Sensor
An element that reads and converts object data into an electric image signal.
Embedded Flash (eFlash) Logic Process
A flash memory circuit implemented inside a system semiconductor circuit.
Ingot
A column of silicon created by melting silicon at a high temperature.
Resistance
A property indicating the degree to which flow of current is obstructed.
Power IC
A semiconductor element that converts and controls electrical power appropriately for a system.
Illumination
A unit for measuring light. Expressed using lux units.
Integrated Device Manufacturer (IDM)
A company that operates all semiconductor processes in-house, from semiconductor design to finished product manufacture.
Deposition
A process wherein a thin film is applied to a wafer surface to impart electrical characteristics.
Integrated Circuit (IC)
A complex nano-scale electronic element or system wherein multiple electronic circuit elements are combined on a single board or with the board itself in a non-separable manner.
In-Vehicle Infotainment (IVI)
A service wherein equipment installed in a vehicle provide information on vehicle status and navigation, as well as entertainment elements for a user.
Extraction Efficiency
The ratio between photons entering an LED and the photons discharged outward.
Capacitor
A device for temporary storage of electricity in an electronic circuit, also called a condensor.
Capacitance
The ability of a capacitor to collect and store electrical charge.
Color Bin
Binning refers to categorizing LED packages according to characteristics. Color binning involves categorizing packages according to light color.
Class
Unit expressing the cleanliness of a semiconductor clean room.
Transistor
A component of electronic circuits created by joining three layers of a silicon or germanium semiconductor. This semiconductor element performs amplifying and switching roles.
Trench method
Technology wherein a semiconductor chip surface is dug out in a trench shape and cells are arranged in the resulting trench to increase integration.
Foundry
An OEM-style semiconductor manufacturer.
Wavelength
The distance that a periodic wave such as a sound wave or electronic wave moves in a single period.
Packaging
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device it is destined for.
Fabless
A company that designs semiconductors only, and does not operate its own production line.
Flash Memory
A type of semiconductor which is able to preserve data even when electrical power is removed.
Flip Chip
A technology used to improve the luminous efficiency of LEDs.
FinFET (Fin Field Effect Transistor)
A 3D process technology adopted to overcome the limitations of the conventional 2-dimensional structure.
ASIC (Application Specific Integrated Circuit)
An integrated circuit designed around special individual functions of a specific field of application or device.
BLU (Back Light Unit)
A component used as the light source for a liquid crystal display (LCD).
CCD Image Sensor
An image sensor that has a CCD (Charge Coupled Device) structure.
CMOS (Complementary Metal Oxide Semiconductor)
A type of integrate circuit used for forming digital circuits in microprocessors or S-RAM, etc.
CMOS Image Sensor (CIS)
A low-power image sensing element having a CMOS (Complementary Metal Oxide Semiconductor) structure.
DDI (Display Driver IC)
An IC chip that drives displays such as TFT LCDs (Thin Film Transistor-Liquid Crystal Display) or PDPs (Plasma Display Panels).
DSP (Digital Signal Processor)
A microprocessor made of up integrated circuits (IC), processing signals through digital computation.
DRAM (Dynamic Random Access Memory)
The main type of RAM used in computers, for high speed and capacity.
EDS (Electrical Die Sorting) Process
A process wherein IC chips formed on a wafer are sorted based on whether or not they are electrically operational.
eMMC (Embedded Multi Media Card)
A memory semiconductor for storage, integrated into mobile devices for fast data processing.
‘GAA Structure’ Transistor
In GAA structure transistors to be introduced in 3nm and smaller circuits, gates surround all four faces of channels through which electric current flows. This allows for finer control of current flow and maximizes channel controllability.
HDD (Hard Disk Drive)
A mass storage device wherein data is stored on disc-shaped boards coated with magnetic material.
LED (Light Emitting Diode)
An electrically-driven light-emitting element made using Ga (gallium), P (phosphorus), and As (Arsenic).
MCP (Multi Chip Package)
A semiconductor in which multiple semiconductor chips are grouped into a single package.
MCU (Micro Controller Unit)
An integrated circuit (IC) that operates devices or controls certain systems.
NFC (Near Field Communication)
A wireless communication technology which allows data exchange at close range within 10cm.
NVMe (Non-Volatile Memory Express) A PCIe interface-based protocol to improve performance and design flexibility of SSD-equipped servers and PCs.
N-type Semiconductor
A semiconductor wherein certain impurities (group 5 elements) are added to a pure semiconductor to increase electron count.
PCI Express (PCIe) (Peripheral Component Interconnect-Express)
An interface standard which overcomes the per-second data transmission speed performance limitation of the conventional SATA interface.
P-type Semiconductor
A semiconductor wherein certain impurities (group 3 elements) are added to a pure semiconductor to increase hole count.
SATA (Serial ATA, Serial Advanced Technology Attachment)
An interface standard using the serial transmission method.
SoC (System on Chip)
A technologically intensive semiconductor integrating an entire system into a single chip
SSD (Solid State Drive)
A next-generation mass storage device using memory semiconductors as a storage medium.
S-RAM (Static Random Access Memory)
A RAM in which data is preserved so long as electrical power is supplied.
TSV (Through Silicon Via)
A packaging technology wherein a top chip and bottom chip are connected by electrodes through fine holes punched into the chips, instead of using conventional wire connections.
3D Vertical NAND Flash Memory
A type of NAND flash memory wherein conventionally single-layer cells are stacked vertically in three dimensions.
UFS (Universal Flash Storage)
Next-generation ultra-fast flash memory applying the ‘UFS 2.0’ interface, the latest internal memory standard issued by JEDEC (Joint Electron Device Engineering Council).
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