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A digital graphic image of the SAFE™ MDI Alliance with a background of high-tech electronic circuitry in blue tones.
A digital graphic image of the SAFE™ MDI Alliance with a background of high-tech electronic circuitry in blue tones.

SAFE™ MDI Alliance

Through collaboration with SAFE™ Multi-Die Integration (MDI) alliance, Samsung Foundry is building a stronger ecosystem for heterogeneous integration packaging.

By bringing together and aligning with EDA, IP, DSP, memory, OSAT, substrate, and test partners, Samsung Foundry is able to offer a one-stop turnkey service for customers with advanced cutting-edge packaging technologies.

Through this alliance, customers and partners can drive silicon and system-level innovation for next-generation HPC, mobile, and automotive products.

  • DSP: Design Solution Partner
  • OSAT: Outsourced Semiconductor Assembly and Test
  • HPC: High Performance Computing
Blus icons of SAFE™ Alliance's Foundry, EDA, IP, DSP and light blue icons of new partners' Memory, Substrate, and test.

Advantages for SAFE™ Multi-Die Integration alliance members

  • technology

    Members are given early access to Samsung Foundry’s unique, comprehensive portfolio of advanced packaging technologies.

  • solution

    Members can continue to develop technological innovations across fields such as chip design, memory modules, substrate technology, testing, manufacturing, and packaging.

  • topic

    Members are provided with co-marketing opportunities at Samsung Foundry Forum (SFF) and SAFE™ Forum.

Close-up view of an electronic chip in the center of a circuit board with blue neon light and glowing connections.

EDA & IP partners

EDA & IP partners can quickly utilize multi-die integration technologies in developing EDA and IP.
Hands and tools of an engineering team discussing over a blueprint spread out on a brightly lit table.

Design Solution Partners (DSP)

Design Solution Partners (DSP) can strengthen service capabilities for design and IP integration by collaborating with mutual customers from an early stage, aligning multi-die integration technologies with Samsung Foundry.
Graphic with blue LED lights highlighting the structure of a semiconductor chip and its circuits

Memory partners

Memory partners can collaborate with Samsung Foundry in early stage to get our engineering and technical support to meet with customer needs. This enables partners to promptly reflect 3D IC design requirements for a quick market penetration for future HBM generations.
A group of scientists in a lab, collaboratively discussing over a tablet.

OSAT & Substrate partners

OSAT & substrate partners can collaborate with Samsung Foundry early in the technology development stage to meet future requirements for multi-die integration technologies.
A robotic arm performing precise tasks in a high-tech lab setting.

Testing Partners

Testing partners can develop standard tests and stress methodologies for multi-die integration technologies through early collaboration with Samsung Foundry. Comprehensive services for product reliability and quality requirements are provided, helping customers bring products to market in a timely manner.
SAFE™ MDI alliance members
SAFE™ MDI alliance members
SAFE™ MDI alliance members
Logos of SAFE™ MDI Alliance Members