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Package turnkey service

Full turnkey
packaging service
Go end to end

Samsung Foundry offers a full end-to-end chip packaging process with comprehensive turnkey services- bringing precision to every step to optimize your product cycles.

Our customers build products that transform the world. To enable these breakthroughs, Samsung Foundry offers turnkey packaging services spanning innovative wafer fabrication and advanced packaging, along with comprehensive polarized stress imaging (PSI) and multiphysics reliability testing, ensuring exceptional quality and consistency throughout.

This drives innovation through memory-logic integration, enabling high-speed data synergy and packaging solutions optimized for performance and power efficiency. With leading-edge heterogeneous integration technologies and strong partnerships across OSAT and PCB ecosystems, we accelerate packaging and help customers bring ideas to life faster in an evolving semiconductor landscape.

Multiphysics simulation + Design optimization

High-power, high-bandwidth, and multi-die solutions supporting for horizontal, vertical and hybrid integration architectures. Comprehensive thermal, electrical, and mechanical analysis and testing – calibrated to ensure high reliability and peak performance across every application.

Leading-edge design solutions to enable high-performance advanced packaging systems

Leading-edge design solutions to enable high-performance advanced packaging systems

Leading-edge design solutions
to enable high-performance advanced packaging systems

Leading-edge design solutions to enable high-performance advanced packaging systems

Leading-edge design solutions
to enable high-performance
advanced packaging systems

Leading-edge design solutions to enable high-performance advanced packaging systems
1

High-power PI solution

2

Thermal design optimization

3

High speed die-to-die interface IP
HBM3 interface IP + Power efficient
die-to-die IO for 3D

4

Efficient multi-die design analysis

5

Area/Power overhead impact analysis

6

Power efficient die-to-die IO for 3D

Total packaging service of

design, assembly, and testing

A total design solution with services and tools to create the systems tailored to your needs. From chip to board, everything is intricately bundled to meet and exceed industry standards with the latest advanced packaging designs, including SiP, horizontal, and vertical integration.

Fully-covered total packaging service

Fab

Fully-covered total packaging turnkey service step 4 - 1. Fab

Logic

Interposer

Si-Capacitor

Bump

Fully-covered total packaging turnkey service step 4 - 2. Bump

C4 Bump

Cu Pillar

uBump

Package

Fully-covered total packaging turnkey service step 4 - 3. Package

Postfab

Assembly

Test

Fully-covered total packaging turnkey service step 4 - 4. Test

Wafer Test

PKG Test

Fully-Covered total packaging service

Fab

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Logic

Interposer

Si-Capacitor

Bump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

C4 Bump

Cu Pillar

uBump

Package

Fully-Covered total packaging turnkey service step 4 - 3. Package

Postfab

Assembly

Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Wafer Test

PKG Test

Fully-Covered total packaging service

Fab

Logic

Interposer

Si-Capacitor

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Bump

C4 Bump

Cu Pillar

uBump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

Package

Postfab

Assembly

Fully-Covered total packaging turnkey service step 4 - 3. Package

Test

Wafer Test

PKG Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Advantages & benefits

Memory integration

Synergy between
Memory & Logic

Advantages & benefits of packaging turnkey service - 1. Memory Integration

Faster TAT & FA

  • Reducing the lead-time
    through simple SCM
  • Faster failure analysis by rich integration experience
  • Faster product bring up

Advanced package

Leading-edge package

Advantages & benefits of packaging turnkey service - 2. Advanced package

Better performance

  • Various PKG solutions by
    customer
    demands

  • Optimized packaging solution

    by Chip/PKG co-design in
    early stage
  • High-power PI solution
    (Ultra-high-density Cap:
    MIM, ISC)

Eco-System

Complete SCM control

Advantages & benefits of packaging turnkey service - 3. Eco-system

Strong Eco-system

  • Enable in-house as well as
    OSAT
    • - Amkor, JCET, ASE-Kr,
      Hana-micron
  • SCM control including
    PCB supplier
    • - Pre-booking PCB capacity by
       LTA (Long-term agreement)

Explore more about advanced packaging