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Samsung Semiconductor at FMS 2026

Samsung
Semiconductor
at FMS 2026

This event is over.
Thank you for joining us at FMS 2026

See what Samsung Semiconductor showcased,
highlighted, and presented at FMS 2026 See what Samsung Semiconductor showcased,
highlighted, and presented at FMS 2026 See what Samsung Semiconductor showcased,
highlighted, and presented at FMS 2026

Aug 4 - 6, 2026

Aug 4 - 6, 2026

Aug 4 - 6, 2026

Samsung Semiconductor at FMS 2026
Samsung Semiconductor at FMS 2026

Moments From The Event

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Samsung Semiconductor booth at FMS 2026
Overview of the FMS 2026 exhibition venue
Samsung Semiconductor booth at FMS 2026
Samsung Semiconductor highlight mock-ups showcasing next-generation memory technologies at FMS 2026
Samsung Semiconductor Cloud AI Memory zone at FMS 2026
Samsung Semiconductor Cloud AI Storage zone at FMS 2026
Visitors exploring the Samsung Semiconductor booth at FMS 2026
Visitors exploring the Samsung Semiconductor booth at FMS 2026
Visitors exploring the Samsung Semiconductor booth at FMS 2026
Samsung Semiconductor keynote presentation at FMS 2026
Samsung Semiconductor keynote presentation at FMS 2026
Samsung Semiconductor at NVIDIA Panel Talk
Audience attending the Samsung Semiconductor keynote at FMS 2026
Samsung Semiconductor receiving an award at FMS 2026
Samsung Semiconductor receiving an award at FMS 2026
Samsung Semiconductor receiving an award at FMS 2026
Speaking Sessions Speaking Sessions Speaking Sessions
Jin-yub Lee
3D Innovations in Memory
& Storage Architecture 3D Innovations in Memory & Storage Architecture 3D Innovations in Memory
& Storage Architecture "zNAND-O breaks through the limitations of both DRAM and Flash." "zNAND-O breaks through the limitations of both DRAM and Flash." "zNAND-O breaks through the limitations of both DRAM and Flash."

Jin-yub Lee

 

EVP, Head of Flash Product & Technology, Memory Business

Samsung Electronics

Jin-yub Lee

 

EVP, Head of Flash Product & Technology, Memory Business

Samsung Electronics

Jin-yub Lee

 

EVP, Head of Flash Product & Technology, Memory Business

Samsung Electronics

3D Innovations in Memory
& Storage Architecture 3D Innovations in Memory & Storage Architecture 3D Innovations in Memory
& Storage Architecture "zHBM will redefine the performance and efficiency limits of HBM." "zHBM will redefine the performance and efficiency limits of HBM." "zHBM will redefine the performance and efficiency limits of HBM."

Kyungryun Kim

 

CVP, DRAM Design Team, Memory Business

Samsung Electronics

Kyungryun Kim

 

CVP, DRAM Design Team, Memory Business

Samsung Electronics

Kyungryun Kim

 

CVP, DRAM Design Team, Memory Business

Samsung Electronics

Kyungryun Kim
Yang Seok Ki
NVIDIA Special Panel NVIDIA Special Panel NVIDIA Special Panel "Storage is no longer just the warehouse behind the AI factory—it is becoming part of the production line." "Storage is no longer just the warehouse behind the AI factory—it is becoming part of the production line." "Storage is no longer just the warehouse behind the AI factory—it is becoming part of the production line."

Yang Seok Ki

 

Head of AGI Computing Lab

Samsung Electronics

Yang Seok Ki

 

Head of AGI Computing Lab

Samsung Electronics

Yang Seok Ki

 

Head of AGI Computing Lab

Samsung Electronics

Featured Products & Technologies Featured Products & Technologies Featured Products & Technologies

Discover Samsung Memory's vision for the next era of AI through breakthrough memory and storage innovations. Experience featured showcases of our next-generation 3D architecture innovations, including zHBM and zNAND-O, alongside interactive mock-ups, live demonstrations, and expert-led theater sessions exploring the future of memory-centric architectures

Discover Samsung Memory's vision for the next era of AI through breakthrough memory and storage innovations. Experience featured showcases of our next-generation 3D architecture innovations, including zHBM and zNAND-O, alongside interactive mock-ups, live demonstrations, and expert-led theater sessions exploring the future of memory-centric architectures

Discover Samsung Memory's vision for the next era of AI through breakthrough memory and storage innovations. Experience featured showcases of our next-generation 3D architecture innovations, including zHBM and zNAND-O, alongside interactive mock-ups, live demonstrations, and expert-led theater sessions exploring the future of memory-centric architectures

Cloud AI Memory

  • HBM4E

    HBM4E

    Pushing AI Memory Performance Beyond Limits

    Learn more
  • CMM-D MD310

    CMM-D MD310

    Next-gen Scalable Memory Solution for Seamless Higher-capacity Performance

    Learn more

Cloud AI Storage

  • V10 Bonding V-NAND

    V10 Bonding V-NAND

    Redefining 3D NAND with Bonding Architecture

  • PM1763

    PM1763

    World Best PCIe Gen.6 SSD
    with Industry-leading Performance

    Learn more
  • BM1773

    BM1773

    World 1st E3.S 256TB QLC SSD

Edge AI

  • LPDDR5X-PIM

    LPDDR5X-PIM

    Bringing AI Compute Closer to Memory

  • LPDDR6

    LPDDR6

    Next-gen Low-power Memory
    Powering the Era of Edge AI

    Learn more
  • UFS 5.0

    UFS 5.0

    Next-gen AI Storage Powering
    the Era of Edge AI

    Learn more

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