Skip to content

See what Samsung Semiconductor showcased, highlighted, and presented at HPE Discover 2024
See what Samsung Semiconductor showcased, highlighted, and presented at HPE Discover 2024
See what Samsung Semiconductor showcased, highlighted, and presented at HPE Discover 2024

At HPE Discover 2024, Samsung Semiconductor showcased innovative memory solutions to accelerate AI in every industry and every device that shapes our world.
At HPE Discover 2024, Samsung Semiconductor showcased innovative memory solutions to accelerate AI in every industry and every device that shapes our world.
At HPE Discover 2024, Samsung Semiconductor showcased innovative memory solutions to accelerate AI in every industry and every device that shapes our world.
 HPE Discover 2024 Video Thumbnail  HPE Discover 2024 Video Thumbnail  HPE Discover 2024 Video Thumbnail

Moments from the Event

Moments from the event Slide Previous View
Moments from the event Slide Next View
Two men discussing the HBM3E 12H technology display at HPE Discover 2024, emphasizing its high capacity and efficiency for AI and HPC.
An overview of Samsung's exhibition space at HPE Discover 2024, presenting cutting-edge innovations in data center and AI technology.
A Samsung representative explaining AI server memory needs to an attendee at the AI Unlocked booth, featuring the HPE ProLiant DL320 Gen11.
Four speakers on stage at HPE Discover 2024, sharing insights and engaging with the audience.
A group of attendees gathering around Data-Driven Computing display at HPE Discover 2024, discussing high-performance server solutions.
A speaker presenting on Powering AI Workloads with Next Generation SSDs at the Hybrid Cloud Theater.
A speaker from Samsung discussing innovations in SSD technology for AI at HPE Discover 2024.
A speaker presenting on CXL Memory Expansion at the Edge & Networking Theater, detailing the features and benefits of CMM-D technology to attendees.
Attendees exploring various Samsung exhibits at HPE Discover 2024, including Data-Driven Computing, AI Unlocked, and other technological advancements.
An interactive session at the Samsung booth with attendees asking questions about CMM-D use-cases in accelerating AI.
Four professionals engaging in a lively discussion at the Hewlett Packard Enterprise and theCUBE broadcast booth during HPE Discover 2024.
Two professionals engaging in a conversation at the Infinite Possibilities booth, exploring the future of AI/ML workloads with CXL and CMM-H.
Attendees at HPE Discover 2024 gathering around a Samsung Data-Driven Computing display, learning about new standards for high-performance servers and workstations.
A professional presentation at HPE Discover 2024, with attendees attentively listening at the Samsung booth.
A group of Samsung team members posing in front of their Data-Driven Computing and AI Unlocked exhibits at HPE Discover 2024.

HPE Discover Kick-off Video
HPE Discover Kick-off Video
HPE Discover Kick-off Video

“Together with HPE, we’re addressing the challenges of AI workloads by providing memory and storage solutions that enhance computational power, while optimizing energy efficiency.”
“Together with HPE, we’re addressing the challenges of AI workloads by providing memory and storage solutions that enhance computational power, while optimizing energy efficiency.”
“Together with HPE, we’re addressing the challenges of AI workloads by providing memory and storage solutions that enhance computational power, while optimizing energy efficiency.”
Alan Walker, Sr. Director, Memory Sales & Marketing, Samsung Semiconductor US
Alan Walker, Sr. Director, Memory Sales & Marketing, Samsung Semiconductor US
Alan Walker, Sr. Director, Memory Sales & Marketing, Samsung Semiconductor US
HPE Discover Opening Video Thumbnail HPE Discover Opening Video Thumbnail HPE Discover Opening Video Thumbnail

theCUBE Interview
theCUBE Interview
theCUBE Interview

“HBM3E is capable of running over 1.2 terabytes per second of speed – placed right next to the GPU or CPU, it gives a tremendous amount of throughput and bandwidth that can be utilized for large language models.”
“HBM3E is capable of running over 1.2 terabytes per second of speed – placed right next to the GPU or CPU, it gives a tremendous amount of throughput and bandwidth that can be utilized for large language models.”
“HBM3E is capable of running over 1.2 terabytes per second of speed – placed right next to the GPU or CPU, it gives a tremendous amount of throughput and bandwidth that can be utilized for large language models.”
R.C. Hurbanis, Director, Memory Business Enablement Engineering, Samsung Semiconductor US
R.C. Hurbanis, Director, Memory Business Enablement Engineering, Samsung Semiconductor US
R.C. Hurbanis, Director, Memory Business Enablement Engineering, Samsung Semiconductor US
theCUBE interview theCUBE interview theCUBE interview

Speaking Sessions
Speaking Sessions
Speaking Sessions

During the speaking sessions, Samsung leaders and experts discussed how our cutting-edge memory solutions enhance server performance and efficiency, empowering next-generation storage technologies in the AI era.
During the speaking sessions, Samsung leaders and experts discussed how our cutting-edge memory solutions enhance server performance and efficiency, empowering next-generation storage technologies in the AI era.
During the speaking sessions, Samsung leaders and experts discussed how our cutting-edge memory solutions enhance server performance and efficiency, empowering next-generation storage technologies in the AI era.
Powering AI Workloads with Next Generation SSDs Powering AI Workloads with Next Generation SSDs Powering AI Workloads with Next Generation SSDs

“As AI models grow more complex, they require larger datasets and faster processing speeds, which in turn requires high-performance storage like SSDs.”

Pankaj Kalra
Director, SSD Product Planning, Samsung Semiconductor US

“Samsung’s SSD solutions provide high density, quick data access, and robust endurance, ensuring that AI applications run smoothly and efficiently.”

Dee Robinson
Director, Memory SSD Product Marketing, Samsung Semiconductor US

image of speaker Pankaj Kalra and Dee Robinson
image of speaker Pankaj Kalra and Dee Robinson

Reimagining Memory and Storage in the AI Era
Reimagining Memory and Storage in the AI Era
Reimagining Memory and Storage in the AI Era

  • Speaker Alan Walker's photo
  • Speaker R.C. Hurbanis's photo
  • Speaker Dee Robinson's photo
  • Speaker Dave Nicholson's photo

Elevating Server Performance with CXL® Memory
Elevating Server Performance with CXL® Memory
Elevating Server Performance with CXL® Memory

  • Speaker Siamak Tavallaei's photo

Featured Products & Technologies

Stop by booth #2360 and discover our cutting-edge memory solutions. Meet with Samsung leaders and experts to find out about our latest products and technologies and how we strive to ensure a sustainable future.

Explore More
Explore More
Explore More

  • HBM3E video thumbnail image

    HBM3E

  • GDDR7 video thumbnail image

    GDDR7

  • PCIe 5.0 SSD PM1743: Unlock the full potential of enterprise

    PCIe 5.0 SSD PM1743: Unlock the full potential of enterprise

  • Samsung Semiconductor: Spearheading the AI Market with HBM3E, GDDR7, and DDR5

    Samsung Semiconductor: Spearheading the AI Market with HBM3E, GDDR7, and DDR5

  • Samsung’s SAS Enterprise SSD to take Server Storage Performance to Next Level

    Samsung’s SAS Enterprise SSD to take Server Storage Performance to Next Level

  • How CXL 2.0 Is Changing the Memory Industry With Its Next-Generation Data Processing

    How CXL 2.0 Is Changing the Memory Industry With Its Next-Generation Data Processing