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Samsung
Semiconductor
at NVIDIA GTC 2026

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See what Samsung Semiconductor showcased,
highlighted, and presented at NVIDIA GTC 2026. See what Samsung Semiconductor showcased, highlighted, and presented at NVIDIA GTC 2026. See what Samsung Semiconductor showcased, highlighted, and presented at NVIDIA GTC 2026.

March 16 - 19, 2026

March 16 - 19, 2026

March 16 - 19, 2026

GTC 2026 Highlight Video
GTC 2026 Highlight Video

Moments From The Event

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Samsung semiconductor booth featuring HBM4 Highest Performance display at NVIDIA GTC 2026
Attendees exploring Samsung's Physical AI Memory and Storage section at NVIDIA GTC 2026
Attendees at the Samsung semiconductor booth showcasing AI Factories and Up to 13Gbps I/O Speed at NVIDIA GTC 2026
Attendees viewing Samsung HBM4 display with 40% Improved Energy Efficiency at the Samsung booth during NVIDIA GTC 2026
Attendees networking at the Samsung semiconductor booth showcasing HBM4 and AI Factories at NVIDIA GTC 2026
Four men engaged in a discussion at the Samsung AI Factories booth during NVIDIA GTC 2026
Jensen Huang, CEO of NVIDIA, signing a Samsung NVIDIA Groq 3 LPU wafer at the Samsung booth during NVIDIA GTC 2026
A speaker addressing press in front of the Samsung and NVIDIA
A Samsung HBM4 wafer signed with
Yong Ho Song presenting a session at NVIDIA GTC 2026
Eyal Pnini presenting on the NVIDIA GTC 2026 main stage
Pankaj Kalra presenting on the NVIDIA GTC 2026 main stage

Speaking Sessions Speaking Sessions Speaking Sessions

Yong Ho Song
"Our collaboration with NVIDIA goes far beyond the Vera Rubin platform. We’re co-authoring the future of AI and memory—side by side. In the AI era, no one innovates alone. Together with our global partners, we turn today’s challenges into tomorrow’s breakthroughs." "Our collaboration with NVIDIA goes far beyond the Vera Rubin platform. We’re co-authoring the future of AI and memory—side by side. In the AI era, no one innovates alone. Together with our global partners, we turn today’s challenges into tomorrow’s breakthroughs." "Our collaboration with NVIDIA goes far beyond the Vera Rubin platform. We’re co-authoring the future of AI and memory—side by side. In the AI era, no one innovates alone. Together with our global partners, we turn today’s challenges into tomorrow’s breakthroughs."

Yong Ho Song

Corporate EVP, Head of AI Center (DS)

Samsung Electronics

Yong Ho Song

Corporate EVP, Head of AI Center (DS)

Samsung Electronics

Yong Ho Song

Corporate EVP, Head of AI Center (DS)

Samsung Electronics

“From silicon to systems, we have hundreds of products ranging from the electronic design automation of the most complex chips … all the way to simulation and analysis tools that are used to analyze and simulate and refine mechanical structures.” “From silicon to systems, we have hundreds of products ranging from the electronic design automation of the most complex chips … all the way to simulation and analysis tools that are used to analyze and simulate and refine mechanical structures.” “From silicon to systems, we have hundreds of products ranging from the electronic design automation of the most complex chips … all the way to simulation and analysis tools that are used to analyze and simulate and refine mechanical structures.”

Shankar Krishnamoorthy

Chief Product Development Officer 

Synopsys

Shankar Krishnamoorthy

Chief Product Development Officer 

Synopsys

Shankar Krishnamoorthy

Chief Product Development Officer 

Synopsys

Shankar Krishnamoorthy
Yong Ho Song
“Samsung and NVIDIA collaboration on HBM doesn’t stop with Rubin. Samsung will continue to work closely with NVIDIA to support its future AI platforms. Together, we will push the boundaries of memory technology to power the next generation of AI.” “Samsung and NVIDIA collaboration on HBM doesn’t stop with Rubin. Samsung will continue to work closely with NVIDIA to support its future AI platforms. Together, we will push the boundaries of memory technology to power the next generation of AI.” “Samsung and NVIDIA collaboration on HBM doesn’t stop with Rubin. Samsung will continue to work closely with NVIDIA to support its future AI platforms. Together, we will push the boundaries of memory technology to power the next generation of AI.”

Eyal Pnini

Sr. Director, Memory Product Marketing

Samsung Semiconductor

Eyal Pnini

Sr. Director, Memory Product Marketing

Samsung Semiconductor

Eyal Pnini

Sr. Director, Memory Product Marketing

Samsung Semiconductor

“Storage used to be in the basement; technically critical but invisible. AI is changing that by pulling storage out of the basement and into the boardroom. It’s an immense opportunity for enterprises, for architects, and for Samsung.” “Storage used to be in the basement; technically critical but invisible. AI is changing that by pulling storage out of the basement and into the boardroom. It’s an immense opportunity for enterprises, for architects, and for Samsung.” “Storage used to be in the basement; technically critical but invisible. AI is changing that by pulling storage out of the basement and into the boardroom. It’s an immense opportunity for enterprises, for architects, and for Samsung.”

Pankaj Kalra

Director, Product Planning

Samsung Semiconductor

Pankaj Kalra

Director, Product Planning

Samsung Semiconductor

Pankaj Kalra

Director, Product Planning

Samsung Semiconductor

Yong Ho Song

Featured Products & Technologies Featured Products & Technologies Featured Products & Technologies

Discover Samsung Memory's approaches to co-designed memory and storage, enabling NVIDIA Rubin for AI factories and accelerating local AI and physical AI with the robust performance and reliability required for the current and next-generation of AI.

Discover Samsung Memory's approaches to co-designed memory and storage, enabling NVIDIA Rubin for AI factories and accelerating local AI and physical AI with the robust performance and reliability required for the current and next-generation of AI.

Discover Samsung Memory's approaches to co-designed memory and storage, enabling NVIDIA Rubin for AI factories and accelerating local AI and physical AI with the robust performance and reliability required for the current and next-generation of AI.

HBM4 Breakthrough

  • HBM4

    HBM4

    The Breakthrough Memory Redefining Performance and Efficiency

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AI Factories: Memory Architecture to Feed, Sustain, and Grow AI

  • LPDDR5X

    LPDDR5X

    Low-Power Memory for AI Compute and Infrastructure Networking

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  • SOCAMM2

    SOCAMM2

    Next-generation high-performance LPDDR-based server module delivering LPDDR efficiency

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  • GDDR7

    GDDR7

    High-performance, low-latency graphics memory powering AI inference workloads

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  • PM1753

    PM1753

    Proven performance, reliability, and security for enterprise systems

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  • PM1763

    PM1763

    PCIe Gen6 storage delivering breakthrough throughput for advanced AI workloads

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Local AI: Efficient Memory & Storage for Local Intelligence

  • PM9E1

    PM9E1

    Compact PCIe Gen5 M.2 storage built for the new wave of personal AI computing

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  • LPDDR5X

    LPDDR5X

    High-speed, low-power memory powering AI at the edge

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  • LPDDR6

    LPDDR6

    Next-generation low-power memory enabling advanced on-device AI

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Physical AI: Memory & Storage for Physical Precision in Motion

  • Automotive LPDDR5X

    Automotive LPDDR5X

    Low-power, reliable memory optimized for intelligent automotive systems

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  • Automotive UFS 3.1

    Automotive UFS 3.1

    High-performance, reliable auto storage

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  • Automotive UFS 4.1

    Automotive UFS 4.1

    High-reliability UFS enabling next-generation automotive intelligence

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  • Detachable AutoSSD

    Detachable AutoSSD

    A new class of detachable automotive storage delivering dependable performance

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  • AM9C1

    AM9C1

    Automotive-grade BGA storage delivering high capacity in a compact footprint

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