▲ By SangJoon Hwang / EVP and Head of DRAM Product & Technology Team, Samsung Electronics
In late 2022, ChatGPT sent shockwaves around the world. In a mere five days, the service had attracted one million subscribers. In two months, this number had surged to 100 million setting the record for fastest sign-up rate that any application has ever seen. ChatGPT has captivated so many users because it offers a broad and versatile range of features with a never-before-seen conversational fluency often indistinguishable from text-based discussions with humans. In short, it has marked a new era of hyperscale AI.
ChatGPT is a large language model (LLM) that uses a vast dataset encompassing 175 billion parameters as its basis for training. As a result, the key to effective delivery of its services lies in high-performance semiconductors. In order to smoothly process such a large volume of data, memory semiconductors need to provide optimized capabilities spanning high performance, high bandwidth and minimized latency for faster reading and writing.
In this new age of hyperscale AI, technological advancements in memory semiconductors and the enhancement of their performance is crucial. Samsung Electronics is deploying its unique technologies to develop a variety of memory solutions through 40 years of industry-leading expertise to expand its AI semiconductor ecosystem.
High-performance HBM: A Vital Component of the AI Era
In 2016, Samsung commercialized the industry’s first high-bandwidth memory (HBM) for high-performance computing (HPC) and pursued opportunities to expand the AI memory market.
A year later, in 2017, Samsung introduced its 8-layer stacked HBM2. When compared to GDDR5 – the fastest memory available at the time – HBM2 delivered eight times the speed. Through HBM2, Samsung successfully demonstrated the viability of 3D stacking technology, which would go on to be an essential component of the new HPC/AI landscape.
Later on, Samsung mass-produced HBM2E and HBM3, and has developed 9.8 gigabits-per-second (Gbps) HBM3E, which we’ll soon start sampling to customers in our drive to enrich the HPC/AI ecosystem.
Looking ahead, HBM4 is expected to be introduced by 2025 with technologies optimized for high thermal properties in development, such as non-conductive film (NCF)1
assembly and hybrid copper bonding (HCB)2
Samsung launched its AVP (AdVanced Package) Business Team in early 2023 to strengthen advanced packaging technology and maximize synergy across business units. Alongside HBM, Samsung will provide advanced custom turnkey packaging services — including 2.5D3
advanced packaging solutions — ideal for the age of HPC and AI.