Connected and autonomous vehicles
are revolutionizing the automotive industry.
From breakthroughs in advanced driver technology to cutting-edge infotainment
the era of smart and seamless
driving is here.
The automotive industry is going through a major transformation. ADAS features, supporting SAE Levels 2, 3, 4 of vehicle automation and employing vehicle to everything (V2X) communications, are enabling safe travel and are leading the way to full SAE Level 5 autonomous driving (AD). Given many of these applications are also safety-critical, our semiconductors meet the intrinsic reliability needed for the 15+ years average lifetime of a passenger vehicle.
Samsung Foundry’s automotive solutions offer next-generation image processing and computer vision features and capabilities. Advances in digital cockpit and in-vehicle infotainment (IVI) technology will deliver
a more compelling driver and passenger experience.
Samsung Foundry is playing a major role in the transformation of the automotive industry with its
high performance platform solutions — from process technology to automotive development flows/methodology to IP enablement and package development.
Samsung ADAS solutions empower drivers to navigate a wide range of road conditions while
providing the connectivity needed to drive immersive in-vehicle infotainment systems.
Enhancing driver safety and low
Advanced driver assistance
experience with powerful
We understand that developing automotive solutions are different
than commercial solutions. We have the safety mindset, the automotive processes (IATF 16949, AEC-Q100, ISO 26262, and others), Automotive Service Packaging (ASP), the automotive ecosystem,
and the engineering expertise to be your next automotive chip
design and manufacturing partner.
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Samsung Foundry has developed a portfolio of FinFET-based automotive process nodes to address ADAS and Infotainment applications. These technologies will have the intrinsic reliability required to satisfy these automotive applications.
Contact Samsung Foundry to learn about the right automotive solutions for your application.
Automotive process nodes, with their automotive design
enablement (PDKs, DRM with SPICE, aging models, EM
models, etc.) and automotive IPs, are developed from
the ground up to meet quality, reliability and safety
Functional Safety (FuSa): ISO 26262 ASIL Ready IP
High Reliability: Stringent AEC-Q100 temperature requirements
Packaging option reliable in
Resistant against electromagnetic
Strong enough to withstand 15+
years of constant
Robust and reliable packaging is critical to enable automotive ICs to operate in the harsh automotive environments of thermal extremes, electromagnetic interference and constant vibration for the expected
15-year life of the vehicle.
Automotive package types include wafer level packaging (WLP/FOWLP), ball grid array (FBGA, PBGA, FC-FBGA, FC-PBGA), lead frame packaging and packaging for modules.