In October 2019, our innovative UFS 3.0 (512GB) was the first in the semiconductor industry to achieve the CO₂ measured PCF label and Water measured PWF (Product Water Footprint) label from the Carbon Trust and demonstrate the possibilities of eco-friendly semiconductor manufacturing.

Compared to our fourth-generation (64 layers) V-Nand-based 256GB chip, our fifth-generation (90+ layers) V-Nand-based UFS 3.0 (512GB) doubles storage capacity, reaches 2.1x faster data transfer speeds and lowers operating voltage by 33% — simultaneously delivering high speeds, high power savings and high productivity. It’s also the only product in the semiconductor industry to have 1.5x more stacked cell layers using our 1 Etching Step process to pierce through 90+ cell layers at once. This lets us reduce the chip size by more than 25% and lessen carbon emissions and water use during production.

The Reducing CO₂ label certification from
the Carbon Trust acknowledges that we have reduced carbon dioxide emissions compared to previous products — in this case, our UFS 3.1 (512GB) in comparison to UFS 3.0 (512GB).

Since the UFS 3.0 (512GB) achieved CO₂
measured label, we worked toward creating a chip that could reduce carbon dioxide emissions even further. The UFS 3.1 (512GB) was recognized with the Reducing CO₂ label, and we once again set a new record by earning the semiconductor industry’s first international environmental certification.

Along with fewer carbon dioxide emissions, our UFS 3.1 (512GB) has 3x faster continuous read-modify-write (RMW) speeds — fast enough to save an FHD movie in about four seconds.