Samsung Semiconductor is taking steps towards carbon reduction for sustainable future

n October 2019, Samsung Semiconductor launched the “UFS 3.0 (512GB)” and it was awarded carbon footprint certification for the first time in the semiconductor industry, worldwide. The “UFS 3.0 (512GB)” is the first semiconductor product where the Carbon Trust has certified its eco-friendly manufacturing results. Even more impressive, the “UFS 3.0 (512GB)” was achieved the CO₂ measured PCF label and Water measured PWF (Product Water Footprint) label at the same time.

The “UFS 3.0 (512GB)” is a high-performance 5th generation (9x layer) 512Gb (gigabit) V-NAND-based product. When compared to the previous 4th generation 64-layer 256Gb V-NAND-based 256GB product, its capacity has been doubled, its data transmission speed has been increased by 2.1 times, and its operating voltage has been lowered by 33% to provide superior speed, power saving abilities, and productivity at the same time. A single process (1 Etching Step) that increases the number of cell stacking layers by approximately 1.5 times and pierces more than 90 layers at once, has been applied to the 5th generation 512Gb V-NAND, and the chip size has been reduced by more than 25% compared to the previous 4th generation V-NAND, in order to minimize carbon emissions and water consumption.

The Carbon Trust awards the reducing CO₂ label certification to newly-launched products when they can prove that they emit less carbon dioxide than their predecessors. The “UFS 3.1 (512GB)”, which is the follow-up product of the “UFS 3.0 (512GB)” which was previously awarded carbon footprint certification, is the industry’s first product to obtain the reducing CO₂ label thanks to the efforts put in to reduce carbon emissions during the development and manufacturing processes of the product.

The “UFS 3.1 (512 GB)” emits less carbon dioxide than the previous “UFS 3.0 (512 GB)” model, and its “continuous write speed” is approximately three times faster, too.

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