Exynos 7 Dual (7270)
Breathtaking technologies in
an ultra-mini package
2) Compared to its predecessor.
When it all seemed impossible, Samsung innovated new package scheme called SiP-ePoP. Samsung developed ePoP package, integrating NAND flash with mobile processor, using special heat resistant properties in 2015. And with power efficient 14nm FinFET process based mobile processor and wearable dedicated Power management IC, Samsung was able to successfully combine the two using SiP packaging. With SiP-ePoP, Exynos 7 Dual successfully integrates all those components into one package.
14nm FinFET Process
Wear longer with
power efficiency than its predecessor built on 28nm process, allowing devices to last longer.
LTE Modem and Connectivity
anywhere at anytime
For easier and faster
- * All functionality, features, specifications and other product information provided in this document including, but not limited to, the benefits, components, performance, availability, and capabilities of the product are subject to change without notice or obligation.