Samsung recently taped out the 3GAE test vehicle design and will focus on improving its performance and power efficiency going forward.
For more information, please refer to the Newsroom links for GAA infographic
and video clip.
The Launching of a New SAFE™–Cloud Program
As part of its ongoing efforts to support and enhance customers’ entire design workflow, Samsung Electronics launched the Samsung Advanced Foundry Ecosystem Cloud (SAFE™-Cloud) program. It will provide customers with a more flexible design environment through collaboration with major public cloud service providers, such as Amazon Web Services (AWS) and Microsoft Azure, as well as leading Electronic Design Automation (EDA) companies, including Cadence and Synopsys.
To date, most foundry customers have built and managed design infrastructure on their own servers. The SAFE™-Cloud program reduces this burden and supports easier, faster and more efficient design efforts by providing an excellent turnkey design environment with extensive process information (PDK, design methodologies), EDA tools, design assets (IP, library) and design services.
Customers can be assured of as much server and storage space as they need, as well as a safe environment optimized for chip design, due to Samsung Electronics’ verification of SAFE™-Cloud’s security, applicability and expandability.
Utilizing the SAFE™-Cloud platform, Samsung was able to accelerate the development of its 7nm and 5nm cell libraries in collaboration with Synopsys. In addition, Samsung, Gaonchips – a fabless design company in Korea – and Cadence have successfully completed design verification based on the platform.
“Making up-front investments in high-performance computing (HPC) servers and systems can be a challenge for a company like us,” said Kyu Dong Jung, CEO of Gaonchips. “SAFE™-Cloud offers us a very flexible design environment without requiring investment in additional infrastructure, as well as reduced design TAT. I expect this program to provide more tangible business and technical benefits to us and the entire fabless industry.”
Process Technology Roadmap and Advanced Packaging Updates
Samsung’s roadmap includes four FinFET-based processes from 7nm down to 4nm that leverage extreme ultraviolet (EUV) technology as well as 3nm GAA, or MBCFET™.
In the second half of this year, Samsung is scheduled to start the mass production of 6nm process devices and complete the development of 4nm process.
The product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the second half of this year and go under mass production in the first half of 2020.
Extensions of the company’s FD-SOI (FDS) process and eMRAM together with an expanded set of state-of-the-art package solutions were also unveiled at this year’s Foundry Forum. Development of the successor to the 28FDS process, 18FDS, and eMRAM with 1Gb capacity will be finished this year.