Power Management System/
Supply,
Battery Management System
Integrated Center Stack,
Instrument Cluster,
Telematics, IVI Domain Controller
Camera Module, Radar Module, LIDAR & Laser Module, V2X,
ADAS Domain Controller
Engine Management System, Motor Controller, Battery Management System,
Zonal Controller
To bring the next-level of driving experience to life, Samsung Foundry is mass-producing IVI solutions for customers using 14nm, 8nm, 5nm, and 4nm process technologies.
For enhanced power solutions, Samsung Foundry is manufacturing a specialized 8-inch PMIC product wafer.
As with IVI solutions, Samsung Foundry is manufacturing 14nm, 8nm, 5nm and 4nm products. Furthermore, we plan to expand auto grade support from AG2 to AG1 for select processes, like 8nm. We’re also developing more advanced nodes for ADAS products requiring higher processing performance, like 4nm and 2nm. With these solutions, we are ready to enable customers to lead the future of autonomous driving.
Samsung Foundry is enabling MCU customers with 28nm embedded non-volatile
memory (eNVM) technologies (embedded Flash and embedded MRAM). In addition,
a FinFET-based eMRAM will
be offered.
For auto grade processes, Samsung Foundry already offers 14nm Logic chips and 28nm eNVM chips at AG1, and SF5A and 8nm Logic chips at AG2. In the coming years, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete 14/8/5nm eMRAM process development.
For auto grade processes, Samsung Foundry already offers 14nm Logic chips and 28nm eNVM chips at AG1, and SF5A and 8nm Logic chips at AG2. In the coming years, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete 14/8/5nm eMRAM process development.
For auto grade processes, Samsung Foundry already offers 14nm Logic chips and 28nm eNVM chips at AG1, and SF5A and 8nm Logic chips at AG2. In the coming years, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete 14/8/5nm eMRAM process development.
Power management is a key aspect of contemporary automotive solutions. To this end, Samsung Foundry provides BCD Power IC in 130nm 1.5 / 3.3 / 5 / 7 ~ 70V / eFlash. There are also plans to release 130nm 100V BCD, 90nm 70V BCD, and +DTI in the coming years.
For eFlash, we will soon offer 1.2V, ESF3.
Power management is a key aspect of contemporary automotive solutions. To this end, Samsung Foundry provides BCD Power IC in 130nm 1.5 / 3.3 / 5 / 7 ~ 70V / eFlash. There are also plans to release 130nm 100V BCD, 90nm 70V BCD, and +DTI in the coming years.
For eFlash, we will soon offer 1.2V, ESF3.
Power management is a key aspect of contemporary automotive solutions. To this end, Samsung Foundry provides BCD Power IC in 130nm 1.5 / 3.3 / 5 / 7 ~ 70V / eFlash. There are also plans to release 130nm 100V BCD, 90nm 70V BCD, and +DTI in the coming years.
For eFlash, we will soon offer 1.2V, ESF3.
Kick off your next generation automotive design with Samsung Foundry’s strong technical foundation; design in confidence with IP covering Analog, Memory Interface, High-Speed Interface, and Security; in addition, automotive-hardened IP-ready support for 14nm, 8nm, and SF5A. Design infrastructure readiness is now available for 14nm, 8nm, and SF5A Technology, and 4nm, 2nm are under development. Design Collateral, and Foundation IPs. For enhanced quality and reliability, we offer AEC-Q100-aware sign-off, DFT & Zero DPPM as well as advanced functional safety for design methodology.
Kick off your next generation automotive design with Samsung Foundry’s strong technical foundation; design in confidence with IP covering Analog, Memory Interface, High-Speed Interface, and Security; in addition, automotive-hardened IP-ready support for 14nm, 8nm, and SF5A. Design infrastructure readiness is now available for 14nm, 8nm, and SF5A Technology, and 4nm, 2nm are under development. Design Collateral, and Foundation IPs. For enhanced quality and reliability, we offer AEC-Q100-aware sign-off, DFT & Zero DPPM as well as advanced functional safety for design methodology.
Kick off your next generation automotive design with Samsung Foundry’s strong technical foundation; design in confidence with IP covering Analog, Memory Interface, High-Speed Interface, and Security; in addition, automotive-hardened IP-ready support for 14nm, 8nm, and SF5A. Design infrastructure readiness is now available for 14nm, 8nm, and SF5A Technology, and 4nm, 2nm are under development. Design Collateral, and Foundation IPs. For enhanced quality and reliability, we offer AEC-Q100-aware sign-off, DFT & Zero DPPM as well as advanced functional safety for design methodology.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 for IP/ Packaging with Auto Grade 2/1 are available. For quality management, our auto service package is IATF 16949-certified by ASP Automotive, ensuring a high standard of excellence. We’ve earned the ISO 26262 functional safety standard and are ASIL-B assessment ready. And for security, we offer complete and configurable IPs for all EVITA security levels.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 for IP/ Packaging with Auto Grade 2/1 are available. For quality management, our auto service package is IATF 16949-certified by ASP Automotive, ensuring a high standard of excellence. We’ve earned the ISO 26262 functional safety standard and are ASIL-B assessment ready. And for security, we offer complete and configurable IPs for all EVITA security levels.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 for IP/ Packaging with Auto Grade 2/1 are available. For quality management, our auto service package is IATF 16949-certified by ASP Automotive, ensuring a high standard of excellence. We’ve earned the ISO 26262 functional safety standard and are ASIL-B assessment ready. And for security, we offer complete and configurable IPs for all EVITA security levels.
Resists Thermal Extremes
Reliability in even the most challenging temperatures
Resists Thermal Extremes
Reliability in even the most challenging temperatures
Resists Thermal Extremes
Reliability in even the most challenging temperatures
Immunity shielding to enable consistent
performance
Immunity shielding to enable consistent
performance
Immunity shielding to enable consistent
performance
Durability to last for 15+ years under demanding conditions
Durability to last for 15+ years under demanding conditions
Durability to last for 15+ years under demanding conditions
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA,FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA,FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA,FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
Through partnerships with key industry leaders, Samsung Foundry’s automotive IP has earned ASIL & AEC-Q100 qualifications.
Through partnerships with key industry leaders, Samsung Foundry’s automotive IP has earned ASIL & AEC-Q100 qualifications.
Through partnerships with key industry leaders, Samsung Foundry’s automotive IP has earned ASIL & AEC-Q100 qualifications.
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