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SAFE™ Forum 2022
On-demand

Samsung Foundry successfully held an in-person SAFE™ Forum, the first since 2019,
in San Jose, CA on October 4th. For those partners and customers who registered for the event,
please enjoy the on-demand videos and exclusive online sessions!

SAFE™ Forum 2022 Highlights

  • Oct 4, 2022 (PDT, GMT-7)
  • Signia by Hilton in San Jose

New foundry technologies and strategies with ecosystem partners were introduced encompassing areas
such as Electronic Design Automation (EDA), IP, Outsourced Semiconductor Assembly and
Test (OSAT), Design Solution Partner (DSP) and the Cloud.

Watch a recap to catch up on anything you might have missed!

What Happened at
SAFE™ Forum 2022

Online-exclusive Tech Sessions

Online-exclusive presentations from our partners are now open at the SAFE™ Forum 2022 Online.
Join us to hear about industry trends and learn from our SAFE partners as they present solutions to
your EDA, IP, DSP, and Packaging challenges!

* People who have already registered for the in-person event can log in with the same ID and password you have registered before.

Samsung & Partner Keynotes at
the SAFE™ Forum 2022

You can also watch a recap of the in-person SAFE™ Forum 2022's keynotes and tech sessions.

  • This video is Ryan Lee's Keynote of SAFE™ Forum 2022
    The Innovation Catalyst
    • Ryan Lee EVP, Head of Design Platform Development
  • This video is Moonsoo Kang's Keynote of SAFE™ Forum 2022
    Samsung Foundry Business & Technology Update
    • Moonsoo Kang EVP, Head of Business Development team

Panel Discussion

How Ecosystem enables the next level of innovation

in HPC, HIT and Chiplets

HPC is a rapidly growing market segment driving significant innovation. AI accelerator,
chiplets, Heterogeneous
Integration Technology, and 2.5/3D packaging are the core factors
transforming HPC applications.

In this session, these awesome panelists shared their perspectives on how the ecosystem can enable

and accelerate the development of the next generation of HPC designs. Please enjoy!

Marco Chisari

EVP, Head of Americas Office Foundry
Sales & Marketing, Samsung Electronics

Charlie Wuischpard

CEO, AYAR LABS

Bardia Pezeshki

CEO, AVICENA

Art Swift

CEO, ESPERANTO

Jonathan Ross

CEO, GROQ

Ramin Shirani

CEO, Ethernovia

WooPoung kim

EVP, Head of Packaging Solutions Center, Samsung Electronics

Variety of Technical Sessions at
SAFE™ Forum 2022

Online event is only available to registered participants.
Please sign in to your registration email and experience the innovative sessions.

GAA and More Moore

Introduction of DTCO collaboration and DM technology from Samsung and its partners!
As Samsung Foundry successfully mass-produced the first GAA, this session focused on the design collaboration with our proud partners.

Multi-die Integration

Introduction of Design Flow and Methodology of overcoming 3DIC design challenges in Multi-Die system design.
Also, this session shared various cases of the latest package technology and collaboration between Samsung, partners, and customers.

Advanced IP for HPC

Introduction of multiple specs from Samsung-developed IPs for HPC application and IP programs provided by SAFE Ecosystem.

Advanced Design Platform

Sharing success cases of Samsung's Advanced Design Platform and platform-applied models from customers and DSPs.

Partners

Get inspired
by our partners!

Introducing the partners of Samsung Foundry’s reinforced SAFE ecosystem. Don't miss the opportunity to expand your knowledge and gain innovative inspiration by networking with our various partners.

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