Power Management System/
Supply,
Battery Management System
Integrated Center Stack,
Instrument Cluster,
Telematics, IVI Domain Controller
Camera Module, Radar Module, LIDAR & Laser Module, V2X,
ADAS Domain Controller
Engine Management System, Motor Controller, Battery Management System,
Zonal Controller
To bring the next-level of driving experience to life, Samsung Foundry is mass-producing IVI solutions for customers using 14nm, 8nm, 5nm, and 4nm process technologies.
For enhanced power solutions, Samsung Foundry is manufacturing a specialized 8-inch PMIC product wafer.
As with IVI solutions, Samsung Foundry is manufacturing automotive products on a variety of nodes from 14nm and 8nm, to 5nm. Furthermore, we plan to expand auto grade support from AG2 to AG1 for select processes, like 8nm. We’re also developing advanced 4nm and 2nm nodes for ADAS products requiring higher processing performance. With these solutions, we help customers define the future of autonomous driving.
Samsung Foundry is enabling MCU customers with 28nm embedded non-volatile
memory (eNVM) technologies (embedded Flash and embedded MRAM). In addition,
a FinFET-based eMRAM will
be offered.
For auto grade processes, Samsung Foundry already offers 14nm logic chips and 28nm eNVM chips at AG1, and SF5A and 8nm logic chips at AG2. In the near future, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete the 14/8nm eMRAM process developments.
For auto grade processes, Samsung Foundry already offers 14nm logic chips and 28nm eNVM chips at AG1, and SF5A and 8nm logic chips at AG2. In the near future, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete the 14/8nm eMRAM process developments.
For auto grade processes, Samsung Foundry already offers 14nm logic chips and 28nm eNVM chips at AG1, and SF5A and 8nm logic chips at AG2. In the near future, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete the 14/8nm eMRAM process developments.
Power management is a key aspect of contemporary automotive solutions. To this end, Samsung Foundry provides BCD Power IC in 130nm 1.5 / 3.3 / 5 / 7 ~ 70V / eFlash. There is also a plan to release 130nm 70V BCD with high performance LDMOS in the near future.
Power management is a key aspect of contemporary automotive solutions. To this end, Samsung Foundry provides BCD Power IC in 130nm 1.5 / 3.3 / 5 / 7 ~ 70V / eFlash. There is also a plan to release 130nm 70V BCD with high performance LDMOS in the near future.
Power management is a key aspect of contemporary automotive solutions. To this end, Samsung Foundry provides BCD Power IC in 130nm 1.5 / 3.3 / 5 / 7 ~ 70V / eFlash. There is also a plan to release 130nm 70V BCD with high performance LDMOS in the near future.
Kick off your next-generation automotive designs with Samsung Foundry’s robust technical foundation – empowering you to design with confidence using IP that spans analog, memory interfaces, high-speed interfaces, security, and automotive-hardened IP with ready support for 14nm, 8nm, and SF5A process technologies. Design infrastructure readiness is available for 14nm, 8nm, and SF5A, with SF4A and SF2A nodes currently under development. Comprehensive design collateral, and foundation IPs further accelerate your path to silicon success. To ensure exceptional quality and reliability, our design methodology integrates AEC-Q100-aware sign-off, DFT and zero-DPPM practices, along with advanced functional safety support.
Kick off your next-generation automotive designs with Samsung Foundry’s robust technical foundation – empowering you to design with confidence using IP that spans analog, memory interfaces, high-speed interfaces, security, and automotive-hardened IP with ready support for 14nm, 8nm, and SF5A process technologies. Design infrastructure readiness is available for 14nm, 8nm, and SF5A, with SF4A and SF2A nodes currently under development. Comprehensive design collateral, and foundation IPs further accelerate your path to silicon success. To ensure exceptional quality and reliability, our design methodology integrates AEC-Q100-aware sign-off, DFT and zero-DPPM practices, along with advanced functional safety support.
Kick off your next-generation automotive designs with Samsung Foundry’s robust technical foundation – empowering you to design with confidence using IP that spans analog, memory interfaces, high-speed interfaces, security, and automotive-hardened IP with ready support for 14nm, 8nm, and SF5A process technologies. Design infrastructure readiness is available for 14nm, 8nm, and SF5A, with SF4A and SF2A nodes currently under development. Comprehensive design collateral, and foundation IPs further accelerate your path to silicon success. To ensure exceptional quality and reliability, our design methodology integrates AEC-Q100-aware sign-off, DFT and zero-DPPM practices, along with advanced functional safety support.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 certification for IP and packaging with Auto Grade 2/1 are available. For quality management, our automotive service package is IATF 16949-certified, ensuring a high standard of excellence. We have also earned the ISO 26262 functional safety certification and are ASIL-B assessment-ready. For security, we offer complete and configurable IPs supporting all EVITA security levels.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 certification for IP and packaging with Auto Grade 2/1 are available. For quality management, our automotive service package is IATF 16949-certified, ensuring a high standard of excellence. We have also earned the ISO 26262 functional safety certification and are ASIL-B assessment-ready. For security, we offer complete and configurable IPs supporting all EVITA security levels.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 certification for IP and packaging with Auto Grade 2/1 are available. For quality management, our automotive service package is IATF 16949-certified, ensuring a high standard of excellence. We have also earned the ISO 26262 functional safety certification and are ASIL-B assessment-ready. For security, we offer complete and configurable IPs supporting all EVITA security levels.
Resists thermal extremes
Reliability in even the most challenging temperatures
Resists thermal extremes
Reliability in even the most challenging temperatures
Resists thermal extremes
Reliability in even the most challenging temperatures
Immunity shielding to enable consistent
performance
Immunity shielding to enable consistent
performance
Immunity shielding to enable consistent
performance
Durability to last for 15+ years under demanding conditions
Durability to last for 15+ years under demanding conditions
Durability to last for 15+ years under demanding conditions
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA, FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA, FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA, FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
Through partnerships with key industry leaders, Samsung Foundry offers automotive customers seamless collaboration to meet their goals.
Through partnerships with key industry leaders, Samsung Foundry offers automotive customers seamless collaboration to meet their goals.
Through partnerships with key industry leaders, Samsung Foundry offers automotive customers seamless collaboration to meet their goals.
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