Skip to content

Package Turnkey Service

Full turnkey
packaging service.
Go end to end

Samsung handles the chip packaging process from end-to-end with turnkey packaging services, bringing precision to every step of the process and optimizing your product cycles.

Our customers create products that change the world. In order to power those breakthroughs, they need cost-effective chip solutions tailor made for their products.
Samsung’s turnkey packaging services deliver precision at every stage of the chipmaking process – from innovative fabrication and packaging, to extensive PSI testing.
From Memory Integration that creates lightning-fast synergy between logic and memory, to Advanced Packaging designs that break barriers in power and efficiency, Samsung offers leading edge solutions in heterogeneous integration, 2.5D and 3D die stacking, and more. And with an extensive ecosystem of OSAT partners and PCB suppliers, Samsung helps its foundry customers fast track the packaging process – so they can modernize product cycles to meet the high-speed demands of today’s markets.

PSI Simulation + Design Optimization

Intuitive solutions tackling high power, high-bandwidth and multi-die design solutions for 2.5, 3D and hybrid architectures.
Explore thermal, electrical and mechanical analysis testing, calibrated to give the high reliability at peak levels of performance.

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance
I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance
I-Cube™ & X-Cube™ Systems

Advanced design solutions for realizing high performance I-Cube™ & X-Cube™ Systems
1

High-power PI solution

2

Thermal design optimization

3

High speed die-to-die interface IP
HBM3 interface IP + Power efficient
die-to-die IO for 3D

4

Efficient multi-die design analysis

5

Area/Power overhead impact analysis

Package Design

A total design solution with services and tools to create the package that works for you. From chip to board, everything is intricately packaged to meet and exceed industry standards with support for the latest advanced packaging designs including SiP, 2.5D and 3D.

Fully-Covered total packaging service

Fab

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Logic

Interposer

Si-Capacitor

Bump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

C4 Bump

Cu Pillar

uBump

Package

Fully-Covered total packaging turnkey service step 4 - 3. Package

Postfab

Assembly

Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Wafer Test

PKG Test

Fully-Covered total packaging service

Fab

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Logic

Interposer

Si-Capacitor

Bump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

C4 Bump

Cu Pillar

uBump

Package

Fully-Covered total packaging turnkey service step 4 - 3. Package

Postfab

Assembly

Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Wafer Test

PKG Test

Fully-Covered total packaging service

Fab

Logic

Interposer

Si-Capacitor

Fully-Covered total packaging turnkey service step 4 - 1. Fab

Bump

C4 Bump

Cu Pillar

uBump

Fully-Covered total packaging turnkey service step 4 - 2. Bump

Package

Postfab

Assembly

Fully-Covered total packaging turnkey service step 4 - 3. Package

Test

Wafer Test

PKG Test

Fully-Covered total packaging turnkey service step 4 - 4. Test

Advantages & benefits

Memory Integration

Synergy between
Memory & Logic

Advantages & benefits of package turnkey survice - 1. Memory Integration

Faster TAT & FA

  • Reducing the lead-time
    through simple
    SCM
  • Faster Failure Analysis by rich
    integration
    experience
  • Faster product bring-up

Advanced package

Leading edge package

Advantages & benefits of package turnkey survice - 2. Advanced package

Better performance

  • Various PKG Solutions by
    customer
    demands

    (I-Cube, X-Cube, H-Cube…)
  • Optimized Package Solution

    by Chip/PKG co-design in
    early stage
  • High-power PI Solution
    (Ultra-high density Cap:
    MIM, ISC)

Eco-System

SCM control of ISAT & PCB

Advantages & benefits of package turnkey survice - 3. Eco-System

Strong Eco-system

  • Enable In-house as well as
    OSAT
    • - Amkor, JXET, ASE-Kr,
      Hana-micron
  • SCM control including
    PCB Supplier
    • - Pre-booking PCB capacity by
      *LTA