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  • The shining hour of stacked memory
    The shining hour of stacked memory
    The shining hour of stacked memory

    The shining hour of stacked memory

Superior performance with HBM3E 12-layer
Superior performance with HBM3E 12-layer
Superior performance with HBM3E 12-layer

A new era of memory has begun. Samsung has achieved mass production of HBM3E stacked with 12 layers, delivering powerful performance in the memory industry. As the fifth generation of HBM, HBM3E Shinebolt achieves exceptional speeds, outstanding power efficiency, and superior thermal resistance. It extends to a wide range of applications, cementing its position as a key enabler for AI technology. A new era of memory has begun. Samsung has achieved mass production of HBM3E stacked with 12 layers, delivering powerful performance in the memory industry. As the fifth generation of HBM, HBM3E Shinebolt achieves exceptional speeds, outstanding power efficiency, and superior thermal resistance. It extends to a wide range of applications, cementing its position as a key enabler for AI technology. A new era of memory has begun. Samsung has achieved mass production of HBM3E stacked with 12 layers, delivering powerful performance in the memory industry. As the fifth generation of HBM, HBM3E Shinebolt achieves exceptional speeds, outstanding power efficiency, and superior thermal resistance. It extends to a wide range of applications, cementing its position as a key enabler for AI technology.

Dash through
your data

A new era of memory has begun. Samsung’s HBM3E Shinebolt pushes the boundaries of high-performance memory with its advanced 12-layer stack. As the fifth generation of HBM, HBM3E delivers lightning-fast speeds. Its 12-layer stack offers up to 1,180GB/s bandwidth at 9.2Gbps, enabling robust performance for demanding workloads. Its scalability ensures it becomes a cornerstone for AI-driven innovation.

Dash through your data

Leverage enhanced thermal resistance

HBM3E Shinebolt boasts a 11% improvement in thermal resistance compared to its predecessor, thanks to its advanced thermal compression non-conductive film(advanced TC NCF) technology. Stacking chips generates heat. To ensure efficient heat dissipation while maintaining strong signal connections between stacked chips, the bumps are strategically designed to be small where signal connection is needed and large where heat dissipation is required. *TC NCF : Thermal Compression - Non-Conductive Film

Leverage enhanced thermal resistance

Cover more
with less power
Cover more
with less power
Cover more
with less power

Make datacenters run around the clock. HBM3E Shinebolt not only elevates performance but does so with less power, boasting an improved power efficiency of approximately 12% over the previous generation.
This advancement translates to reduced energy consumption and lower operational costs for datacenters.
Make datacenters run around the clock. HBM3E Shinebolt not only elevates performance but does so with less power, boasting an improved power efficiency of approximately 12% over the previous generation. This advancement translates to reduced energy consumption and lower operational costs for datacenters.
Make datacenters run around the clock.
HBM3E Shinebolt not only elevates performance but does so with less power, boasting an improved power efficiency of approximately 12% over
the previous generation.

This advancement translates to reduced energy consumption and lower operational costs for datacenters.
Cover more with less power

Support a wider range of applications

With the rapid growth of AI, HBM3E Shinebolt is quickly becoming the definitive high-performance memory solution across industries.

Datacenters rely on it for expanding AI services, supercomputers leverage it for massive data processing, and it plays a critical role in network infrastructure as well as in the future of advanced autonomous driving.
Support a wider range of applications

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All product specifications reflect internal test results and are subject to variations by the user's system configuration

All product images shown are for illustration purposes only and may not be an exact representation of the product

Samsung reserves the right to change product images and specifications at any time without notice

For further details on product specifications, please contact the sales representative of your region.

Applications for HBM3E Shinebolt

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