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Wafer

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Wafer The key material used to create semiconductor integrated circuits. A thin and round sheet made by slicing a monocrystalline ingot obtained by growing silicon (Si), gallium arsenide (GaAs), and other materials. ※ Wafer parts and names
웨이퍼1
웨이퍼1

① Chip: The thin and small piece on the wafer where the electrical circuits are embedded. The IC chip. ② Scribe Line: The border between the chip without any electrical circuits. Lines to separate each chip on the wafer. ③ TEG (Test Element Group): A chip to test whether it works or not. ④ Edge Die: The damaged part. A bigger wafer has less damage than a wafer with a smaller diameter, which also reduces the loss factor. ⑤ Flat Zone: The flat part to distinguish the round wafer structure.
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