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Where AI workloads meet
next-generation storage
Where AI workloads meet
next-generation storage
Where AI workloads meet next-generation storage

Samsung PM1763 is a PCIe® Gen6 enterprise SSD engineered to support emerging storage requirements in modern AI and high-performance computing environments. With high-throughput data processing, improved power efficiency, and enhanced security capabilities, PM1763 is well suited for deployment across hyperscale data center architectures. Samsung PM1763 is a PCIe® Gen6 enterprise SSD engineered to support emerging storage requirements in modern AI and high-performance computing environments. With high-throughput data processing, improved power efficiency, and enhanced security capabilities, PM1763 is well suited for deployment across hyperscale data center architectures. Samsung PM1763 is a PCIe® Gen6 enterprise SSD engineered to support emerging storage requirements in modern AI and high-performance computing environments. With high-throughput data processing, improved power efficiency, and enhanced security capabilities, PM1763 is well suited for deployment across hyperscale data center architectures.

Exploring the bandwidth potential of PCIe Gen6 Exploring the bandwidth potential of PCIe Gen6 Exploring the bandwidth potential of PCIe Gen6

PM1763 enables stable PAM4 signaling in PCIe Gen6 environments, achieving up to 2× higher performance1) compared to the previous generation. With sequential read speeds of up to 28,400 MB/s and write speeds of up to 21,000 MB/s, PM1763 is designed to help reduce data transfer constraints and support efficient data movement across AI-driven workloads.


1) Based on internal evaluations, performance may vary depending on system configuration and environment. (Details available upon request)

PM1763 enables stable PAM4 signaling in PCIe Gen6 environments, achieving up to 2× higher performance1) compared to the previous generation. With sequential read speeds of up to 28,400 MB/s and write speeds of up to 21,000 MB/s, PM1763 is designed to help reduce data transfer constraints and support efficient data movement across AI-driven workloads.


1) Based on internal evaluations, performance may vary depending on system configuration and environment. (Details available upon request)

PM1763 enables stable PAM4 signaling in PCIe Gen6 environments, achieving up to 2× higher performance1) compared to the previous generation. With sequential read speeds of up to 28,400 MB/s and write speeds of up to 21,000 MB/s, PM1763 is designed to help reduce data transfer constraints and support efficient data movement across AI-driven workloads.


1) Based on internal evaluations, performance may vary depending on system configuration and environment. (Details available upon request)

Concept image illustrating improved performance of PM1763 enabled by the PCIe Gen6 interface
Designed for efficient operation at hyperscale Designed for efficient operation at hyperscale Designed for efficient operation at hyperscale

PM1763 incorporates controller architecture optimizations and design enhancements to improve power efficiency by up to 1.8×2) compared to the previous generation. Designed with thermal considerations, PM1763 aligns with emerging server architectures—including liquid-cooled systems—supporting flexible integration in performance-focused, high-density deployments.


2) Based on internal evaluations, performance may vary depending on system configuration and environment. (Details available upon request)

PM1763 incorporates controller architecture optimizations and design enhancements to improve power efficiency by up to 1.8×2) compared to the previous generation. Designed with thermal considerations, PM1763 aligns with emerging server architectures—including liquid-cooled systems—supporting flexible integration in performance-focused, high-density deployments.


2) Based on internal evaluations, performance may vary depending on system configuration and environment. (Details available upon request)

PM1763 incorporates controller architecture optimizations and design enhancements to improve power efficiency by up to 1.8×2) compared to the previous generation. Designed with thermal considerations, PM1763 aligns with emerging server architectures—including liquid-cooled systems—supporting flexible integration in performance-focused, high-density deployments.


2) Based on internal evaluations, performance may vary depending on system configuration and environment. (Details available upon request)

Concept illustration showing liquid cooling architecture managing SSD thermal output in a server system
Advanced security for AI-ready infrastructure Advanced security for AI-ready infrastructure Advanced security for AI-ready infrastructure

PM1763 supports security requirements for AI-driven and virtualized infrastructures. Support for PQC3), SPDM4) 1.4, and CNSA5) 2.0, along with TDISP6)-based link encryption, helps reinforce data protection and integrity across storage interfaces.


※ Acronyms are defined for reference.

3) PQC (Post-Quantum Cryptography): Cryptographic techniques designed to maintain security in the presence of quantum computing capabilities.

4) SPDM (Security Protocol and Data Model): A standard protocol for device authentication and secure communication between components.

5) CNSA (Commercial National Security Algorithm Suite): A set of cryptographic algorithms defined to support security requirements in the post-quantum era.

6) TDISP (TEE Device Interface Security Protocol): A security protocol that enables protected data exchange between devices and hosts in virtualized environments.

7) SED (Self-Encrypting Drive): A storage device that automatically encrypts data using built-in hardware to protect information at rest.

8) IDE (Integrity and Data Encryption): A security feature that protects data by providing encryption and integrity verification during transmission.

PM1763 supports security requirements for AI-driven and virtualized infrastructures. Support for PQC3), SPDM4) 1.4, and CNSA5) 2.0, along with TDISP6)-based link encryption, helps reinforce data protection and integrity across storage interfaces.


※ Acronyms are defined for reference.

3) PQC (Post-Quantum Cryptography): Cryptographic techniques designed to maintain security in the presence of quantum computing capabilities.

4) SPDM (Security Protocol and Data Model): A standard protocol for device authentication and secure communication between components.

5) CNSA (Commercial National Security Algorithm Suite): A set of cryptographic algorithms defined to support security requirements in the post-quantum era.

6) TDISP (TEE Device Interface Security Protocol): A security protocol that enables protected data exchange between devices and hosts in virtualized environments.

7) SED (Self-Encrypting Drive): A storage device that automatically encrypts data using built-in hardware to protect information at rest.

8) IDE (Integrity and Data Encryption): A security feature that protects data by providing encryption and integrity verification during transmission.

PM1763 supports security requirements for AI-driven and virtualized infrastructures. Support for PQC3), SPDM4) 1.4, and CNSA5) 2.0, along with TDISP6)-based link encryption, helps reinforce data protection and integrity across storage interfaces.


※ Acronyms are defined for reference.

3) PQC (Post-Quantum Cryptography): Cryptographic techniques designed to maintain security in the presence of quantum computing capabilities.

4) SPDM (Security Protocol and Data Model): A standard protocol for device authentication and secure communication between components.

5) CNSA (Commercial National Security Algorithm Suite): A set of cryptographic algorithms defined to support security requirements in the post-quantum era.

6) TDISP (TEE Device Interface Security Protocol): A security protocol that enables protected data exchange between devices and hosts in virtualized environments.

7) SED (Self-Encrypting Drive): A storage device that automatically encrypts data using built-in hardware to protect information at rest.

8) IDE (Integrity and Data Encryption): A security feature that protects data by providing encryption and integrity verification during transmission.

Concept image illustrating security features supported by PM1763 including PQC, SPDM and TDISP
Flexibility for diverse system requirements Flexibility for diverse system requirements Flexibility for diverse system requirements

PM1763 supports E1.S, E3.S and U.29) form factors with capacities ranging from 4 TB to 64 TB, enabling flexible configurations based on system requirements. Built on PCIe Gen6-based NVMe® 2.1 and OCP® 2.6 standards, PM1763 aligns with evolving platform requirements while maintaining compatibility with existing infrastructures. Expanded telemetry and enhanced error recovery further contribute to reliable operation in large-scale data center environments.

 

9) U.2 form factor supports PCIe Gen5 interface only.

PM1763 supports E1.S, E3.S and U.29) form factors with capacities ranging from 4 TB to 64 TB, enabling flexible configurations based on system requirements. Built on PCIe Gen6-based NVMe® 2.1 and OCP® 2.6 standards, PM1763 aligns with evolving platform requirements while maintaining compatibility with existing infrastructures. Expanded telemetry and enhanced error recovery further contribute to reliable operation in large-scale data center environments.

 

9) U.2 form factor supports PCIe Gen5 interface only.

PM1763 supports E1.S, E3.S and U.29) form factors with capacities ranging from 4 TB to 64 TB, enabling flexible configurations based on system requirements. Built on PCIe Gen6-based NVMe® 2.1 and OCP® 2.6 standards, PM1763 aligns with evolving platform requirements while maintaining compatibility with existing infrastructures. Expanded telemetry and enhanced error recovery further contribute to reliable operation in large-scale data center environments.

 

9) U.2 form factor supports PCIe Gen5 interface only.

Product views of Samsung PM1763 in E1.S and E3.S form factors

Applications for PM1763

* The contents of this page are provided for informational purposes only. No representation or warranty (whether express or implied) is made by Samsung or any of its officers, advisers, agents, or employees as to the accuracy, reasonableness or completeness of the information, statements, opinions, or matters contained in this page, and they are provided on an "AS-IS" basis. Samsung will not be responsible for any damages arising out of the use of, or otherwise relating to, the contents of this page. Nothing in this page grants you any license or rights in or to information, materials, or contents provided in this document, or any other intellectual property.
* The contents of this page may also include forward-looking statements. Forward-looking statements are not guarantees of future performance and that the actual developments of Samsung, the market, or the industry in which Samsung operates may differ materially from those made or suggested by the forward-looking statements contained in this page.
* All design, features and specifications represented herein may change without notice.
* Images shown here have been adjusted for demonstration purposes and may appear differently on the actual products.
* All data on products herein, including their performances, are based on internal testing using standard Samsung benchmarks under laboratory conditions.
* Test results do not guarantee future performance under such test conditions, and the actual throughput or performance that any user will experience may vary depending upon many factors.
* For further details on product specifications, please contact the sales representative of your region.

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