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Samsung HBM4 36GB MTV

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Samsung announces availability in November 2024 of its HBM4 36GB Mechanical Test Vehicle (MTV), for use by OEM customers wanting to prepare for the advanced Samsung HBM4 36GB production devices coming in 2025.

Image showing front and rear view of Samsung HBM4 36GB MTV
Image showing front and rear view of Samsung HBM4 36GB MTV

What Is Samsung HBM4 36GB MTV?

The Samsung HBM4 36GB MTV is a fully functional prototype of the final HBM4 device, designed to be used for package assembly set-up, pre-qualification, and thermal pre-evaluation tests. It incorporates innovative architectural aspects such as cutting-edge Through-Silicon Via (TSV) and 12-high 3D package stack technologies to more realistically represent the operation of the final device.

The eventual production Samsung 36GB HBM4 device will provide improved power efficiency through utilization of advanced DRAM process technology on the core and SF4x (4 nm-class) logic process technology on the base die. Therefore, the Samsung HBM4 36GB MTV is based on these same technologies to allow customers to predict performance accurately, to pre-optimize package assembly set-up, and to meaningfully test thermal conditions.

 

Features and Benefits

JEDEC HBM4 compliance. Samsung HBM4 36GB MTV design is fully compliant to the key parameters listed in the JEDEC HBM4 specification.

Functional equivalence. To effectively prototype the eventual Samsung HBM4 36GB product, the Samsung HBM4 36GB MTV supports operation with a 2,048 I/O bus.

Stack density. The 36GB stack density of the MTV is 1.5x that of the previous generation HBM3E device.

Power supply. The process technology allows for qualification using a lower VDDQ power supply, a design scheme that is required by next-generation High-Performance Computing (HPC) and Artificial Intelligence (AI) systems.

 

Summary

The Samsung HBM4 36GB MTV is the world’s first prototype test vehicle to integrate state-of-the-art DRAM and logic processes. Its purpose is to aid industry partners to better comprehend the value propositions compared to previous HBM line-ups, and to accelerate package assembly and thermal condition set-up stages. This test vehicle will help industry stakeholders get ready for eventual HBM4 product evaluation and qualification – substantially reducing time-to-market.