Samsung Foundry Showcases Expertise at Hot Chips 2024 as One-Stop Solutions Provider for HPC and AI

Hot Chips, one of the semiconductor industry's leading conferences on high-performance microprocessors and integrated circuits, took place on August 25-27 at Memorial Auditorium on the beautiful Stanford University campus. The event provided attendees with educational tutorials, insightful presentations, and hands-on exhibitions covering topics ranging from AI-assisted HW design to the ‘Cooling of Hot Chips’, as well as the latest advances in AI and networking processors.

Samsung Foundry showcased its advanced process technologies and design solutions, including demonstrations of its I-Cube and X-Cube advanced packaging. Samsung Foundry experts engaged in discussions with attendees about potential collaborations and future technologies. These conversations are crucial for building a strong and innovative foundry ecosystem with partners and customers.

At the event, IBM announced their latest IBM Telum II Processor and IBM Spyre Accelerator chips manufactured on Samsung Foundry’s 5nm process node. Samsung Foundry’s 5nm FinFET technology enables HPC/AI systems to do more than ever with less power consumption. With Samsung Foundry being a long-standing fabrication partner with IBM, this collaboration will support future AI capabilities and enable advancements in various practical applications.

Samsung Semiconductor continues to demonstrate at industry events like Hot Chips that it is uniquely positioned as a true one-stop AI solution provider integrating foundry, memory, and advanced packaging capabilities.