Samsung Electronics Highlights Open Collaboration for the AI Era at OCP Global Summit 2025

Samsung Electronics participated in OCP Global Summit 2025, held at the San Jose Convention Center in California, where it showcased next-generation memory and storage solutions optimized for AI data centers and infrastructure.

Organized by the Open Compute Project (OCP), OCP Global Summit is the industry’s leading event focused on driving innovation and standardization for data center technologies. Under the theme of “Leading the Future of AI,” this year’s event emphasized the growing importance of open collaboration and standardization across the AI ecosystem. A significant rise in both exhibitors and attendees compared with last year highlighted the industry’s increasing investment in AI infrastructure and OCP’s expanding influence across the industry.

As a Diamond Sponsor, Samsung presented 16 technical sessions and 14 product demonstrations under the theme: “Shaping the Future of Memory Open Innovation.”

In an Executive Session, Taeksang Song, Vice President of DRAM Solutions at Samsung Electronics, delivered a presentation titled: “Memory for Every AI Need: Samsung’s Next-gen Memory Solutions to Lead the Future of AI↗.” He introduced Samsung’s comprehensive AI memory portfolio, ranging from high-performance, high-capacity products such as HBM4 and MRDIMM (Multi-Ranked Buffered DIMM) to low-power solutions including LPDDR6 and SOCAMM2 (Small Outline Compression Attached Memory Module), as well as next-generation innovations like LPDDR5X-PIM and CMM-D (CXL Memory Module DRAM).

Following his presentation, attendees engaged in an in-depth Q&A on CXL-related technologies, including memory pooling and DDR compatibility, reflecting the industry’s growing interest in Samsung’s AI memory innovations.

In an Expo Hall Session, Samsung presented its CXL solutions integrated into next-generation AI servers jointly developed with partners Montage Technology and H3 Platform under the title: “Heterogeneous Memory System Architecture for Next-gen Agentic AI Server Platform↗.” The session underscored Samsung’s commitment to expanding the next-generation memory ecosystem through open, partnership-driven collaboration. In addition, a series of technical sessions co-presented with partners covered various AI-related topics, offering in-depth insights into technology advancements enabled by open collaboration.

The Samsung booth at OCP Global Summit featured two dedicated zones — AI Memory and AI Storage — showcasing next-generation products and technologies that are shaping the future of the AI era.

In the AI Memory Zone, Samsung showcased its lineup of high-performance HBM products, including HBM4 and Custom HBM, alongside next-generation low-power solutions based on LPDDR technology, such as SOCAMM2 and LPDDR5X-PIM. Samsung’s HBM4, developed with the industry’s most advanced DRAM process and 4nm logic technology, achieved an industry-leading data rate of 11Gbps, far exceeding the JEDEC standard of 8Gbps, and became one of the most talked-about highlights of the exhibition. A visualized model of the Custom HBM structure also drew significant attention, allowing visitors to interact with various base dies and experience customizable configurations firsthand. In response to rising demand for energy-efficient memory, Samsung presented SOCAMM2 and LPDDR5X-PIM through video content that emphasized key features and helped visitors better understand these emerging next-generation solutions.

In the AI Storage Zone, Samsung unveiled its latest AI data center storage solutions, PM1763 and BM1753. In particular, PM1763, Samsung’s first PCIe Gen6-based SSD, sparked strong interest and active discussions among industry attendees.

Samsung also presented seven demonstrations, underscoring its contributions to expanding the open, collaboration-driven ecosystem. Through demos such as Virtual SSD Migration, AiSIO (Accelerator-initiated Storage I/O) and FDP (Flexible Data Placement), the company showcased next-generation storage technologies optimized for AI workloads, including improved server-to-server data mobility enabled by virtual SSDs, direct GPU-to-storage connectivity, and enhanced data write efficiency.

In addition, Samsung unveiled CXL 2.0-based demonstrations featuring CMM-D and CMM-DC, the latter integrating PNM (Processing Near Memory) technology, with both solutions designed to expand memory capacity and bandwidth. These exhibits highlighted memory pooling technologies and real-world use cases, such as fraud detection powered by Samsung’s in-house Cognos memory pooling management platform, and AI RAG workload optimization. The demos clearly showcased measurable performance gains and total cost of ownership (TCO) benefits enabled by CXL adoption. Samsung also received strong on-site feedback through a joint showcase with partners, which featured actual CMM-D deployment examples in customer server.

Through its participation in OCP Global Summit, Samsung shared its vision and collaborative roadmap for open innovation in AI infrastructure. Across multiple sessions and exhibitions, Samsung presented next-generation memory and storage roadmaps alongside partnership-driven case studies, demonstrating the scalability and potential of an open AI ecosystem. Looking ahead, Samsung aims to further accelerate the evolution of the AI ecosystem through continuous product innovation and open collaboration.