Skip to content

Packaging

  • mail
Packaging A process wherein a semiconductor chip is packaged in a form suitable for the electronic device. Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they’re installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.
패키지 테스트
패키지 테스트
Related contents
Related Contents

Would you like to
leave this page? If you leave this page, the content you are creating
will not be saved.

Back Leave

Registration Are you sure you want to submit this?

Back
Thank you! Please confirm your registration

Your subscription is not active yet!
An email with an activation link
has just been sent to your email address.
Please activate your subscription by clicking on
the activation link inside the email.

Confirm
Thank you! Please confirm

your existing registration

You have already registered, but before we can send you the
information about upcoming events, we need your confirmation.

If you missed our previous email, please use the button below to resend it.
To activate your subscription, please click on the link included in the email.

Resend
Alert

To proceed, please click on the "check" button located in the email section.

Confirm