Next-Generation Process Development

Samsung Foundry has broken through technological limits and achieved several world-firsts, including the development of 14nm FinFET, 7nm EUV, and 3nm GAA processes. Now, we are poised to make new advancements in the AI era with ultra-fine process nodes and next-generation advanced technologies like BSPDN¹ and Co-packaged optics (CPO).² Regarding FinFET, the 4nm process will continue to expand for applications in mobile and automotive. As for advanced GAA processes, we will move beyond the 3nm node and develop 2nm SF2Z (BSPDN) for HPC/AI and SF2A for automotive applications. Additionally, we plan on strengthening our technology leadership in the global market through the development of a 1.4nm GAA process in the future.

¹ BSPDN (Back Side Power Delivery Network): A back-side power delivery technology that places the current wiring layer on the back of the wafer to improve bottlenecks in power and signal lines.
² Co-packaged optics (CPO): A semiconductor signal transmission method using photons, which significantly improves data transfer rate and heat dissipation issues.

Optimal Customized Solutions for Applications

Samsung Foundry offers a total design platform that meets a wide range of customer needs. We support core applications such as HPC, mobile/5G, automotive, and the Internet of Things (IoT) with next-gen process technology. These include eMRAM, PMIC, DDI, CIS, and RF for high-speed non-volatile memory, power management, and image sensors. Through our dedicated design platform that includes libraries, PDKs, DM, IP, design support, packaging, and cloud services, customers can enjoy differentiated benefits and comprehensive services.

World-class Manufacturing Capabilities

Based on a wide foundry network that spans from Giheung, Hwaseong, and Pyeongtaek in Korea to Austin and Taylor in the U.S., Samsung Foundry has mass production capabilities for both legacy and advanced semiconductors. These fabs benefit from remote management provided by the Integrated Operations Center, which enhances their efficiency and manufacturing capabilities. Additionally, through manufacturing process automation (A-Fab), and AI technology for yield improvement, our smart fab achieves world-class capabilities in terms of semiconductor production cycle and yield.

Optimized Design Platform Based on SAFE™ Partnership

Through SAFE™ (Samsung Advanced Foundry Ecosystem), Samsung Foundry strengthens its partnerships and collaborations to provide trusted solutions and value to customers. With our IP, EDA, Cloud, DSP, and OSAT alliance partners, we actively address customer challenges from the design stage. Additionally, the MDI Alliance for next-generation packaging technology offers advanced heterogeneous integration packaging for 2.5D/3D IC as a one-stop turnkey service. Through this, we optimize customer designs across the entire process and implement the development of advanced customized chips.