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Flip Chip

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Flip Chip A technology used to improve the luminance efficiency of LEDs.
This technology welds semiconductor chips to circuit boards using only the electrode patterns on the bottom of the chips without using additional connection structures like metal lead (wires) or intermediate mediums like ball grid arrays (BGAs). These are also called “leadless”  semiconductors. As the package is the same size as the chip, its advantages lie in the smaller size  and lighter weight as well as finer distance between electrodes.
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