EDS Process

[Electrical Die Sorting] A process to check integrated circuit chips formed on a wafer function properly. EDS stands for Electrical Die Sorting, and is an inspection process to check individual chips on a near-completed wafer to verify each chip function properly. The EDS process comprises five major steps; 1. ET Test & WBI (Electrical Test & Wafer Burn In); 2. Pre-Laser; 3. Laser Repair & Post Laser; 4. Tape Laminate & Back Grinding; and 5. Inking. Electrical testing is the first step, and checks whether each chip has reached the prescribed quality levels. At each inspection step, chips that fail the inspection are sorted into two categories. Repairable chips are sent to be repaired, and chips beyond repair are marked (inked) and omitted from subsequent processes. The EDS process is an important first step in the semiconductor process wherein defective chips are sorted from good ones.