As the world leader in advanced memory technology, Samsung’s portfolio of the latest mobile memory guarantees a solution for any power budget and performance class. The latest member of the mobile DRAM portfolio--the LPDDR4X 8GB POP with 10nm-class 16Gb LPDDR4X—joined the exhibit, boasting 30% better power efficiency over its predecessor LPDDR4. The highest-capacity MCP was also introduced at the scene. The GX128.48 uMCP incorporates two leading-edge process technologies—4th gen V-NAND UFS and 10nm-class 16Gb LPDDR4X—to provide increased capacity while reducing footprint. Samsung showcased its continuous development of mobile storage solutions with the world’s first UFS v3.0 interface product, which is to debut in Q1 2018, as well as an UFS v2.1 interface product which boasts the highest density in the eStorage market at 512GB.
Vast advancements in image sensors have spurred the replacement of point-and-shoot cameras with smartphones in recent years, with near DSLR-level image quality. Another CES 2018 Innovation Awards HONOREE, the Samsung ISOCELL Slim 2X7 image sensor is the epitome of these advancements. It is a 24 megapixel image sensor that uses the industry’s smallest 0.9μm sized pixel. With 0.9um sized pixels, a high resolution 24Mp image sensor and its camera module can be built in a much smaller form to fit in a very slim smartphone. In addition, the sensor also takes advantage of Tetrapixel, a technology that merges four neighboring pixels to work as one to increase light sensitivity to take brighter and sharper pictures even in a low-lit environment.
Server and High-speed Memory Solutions
For server memory solutions, 256GB 3DS DDR4 DIMM (16Gb Comp.), the industry’s first highest standard DIMM, was accompanied by the line-up of client SSDs and enterprise SSDs with both NVMe and SATA interfaces, including the CES 2018 Innovation Awards HONOREE PM983—the first 8 terabyte “next-generation small form factor (NGSFF)”—which can deliver I/O at a phenomenal 0.5 petabytes in a 1U rack per second while improving space utilization and scaling options in hyper-scale datacenter servers.
16Gb GDDR6 Graphic DRAM and HBM2 Aquabolt™ were introduced as high-speed memory solutions. GDDR6 Graphic DRAM, another 2018 Innovation Awards HONOREE from Samsung, is the fastest and largest density Graphic DRAM for advanced graphics processing for gaming devices and graphics cards as well as automotive, network and artificial intelligence systems with data transfers of 16 gigabits per second (Gbps), which represents a more than two-fold increase over 8Gb GDDR5 with its 8Gbps pin speed. HBM2 Aquabolt™ delivers a 2.4 gigabits-per-second (Gbps) data transfer speed per pin with 1024 I/O, making it ideal for high-performance applications, such as for use in next-generation supercomputers, AI solutions and graphics systems, with these improvements, a single Samsung 8GB HBM2 package will offer a 307 gigabytes-per-second (GB/s) data bandwidth.