Package Turnkey Service

Our customers create products that change the world. In order to power those breakthroughs, they need a range of Advanced Packaging solutions, targeting optimized system performance to cost-effective chip integration solutions—all tailor made for their products.
Samsung’s turnkey packaging services deliver precision at every stage of the chip making process from innovative fabrication and packaging to extensive PSI and Multiphysics reliability testing.
From Memory Integration that creates lightning-fast synergy between logic and memory to Advanced Packaging designs that breakdown barriers in power and efficiency, Samsung offers leading edge solutions in heterogeneous integration, 2.5D and 3D die stacking, and more.

And with an extensive ecosystem of OSAT partners and PCB suppliers, Samsung helps its foundry customers fast track the packaging process, so they can shorten product turnaround times while meeting the high-speed performance goal of today’s markets.