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  • Advanced packaging
    Advanced packaging
    Advanced
    packaging

    Samsung Foundry Advanced Package

Multi-chip integration, performance at scale

Advanced heterogeneous integration

Advanced heterogeneous integration brings the best of today’s chips together into one intelligent system – empowering innovation across AI, HPC, and next-generation applications through exceptional performance, power efficiency, and design scalability.

Horizontal integration

Horizontal integration packaging deploys parallel horizontal chip placement to boost performance while combating heat buildup. Samsung’s Through Silicon Via (TSV) and Backend-of-Line (BEOL) technologies form a foundation for multiple chips to integrate their specialized functions to deliver more powerful and efficient solutions for modern devices.

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Horizontal Integration

Horizontal integration

Vertical integration

Vertical integration packaging takes performance to the next level by stacking components vertically, significantly shortening interconnect wire lengths. It dramatically reduces yield risks associated with large monolithic dies through its advanced 3D integration – delivering higher system performance and lower cost, while maintaining high bandwidth and power efficiency.

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Vertical integration

Vertical integration

Package turnkey service

Build it your way with end-to-end packaging solutions

Your products are as unique as the chips that power them. Samsung Foundry delivers precision at every stage of the chip making process – transforming innovation into reality. Bring your designs to life with end-to-end solutions – from design and fabrication to advanced packaging and testing.

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Performance & power optimized technologies for
monolithic or heterogeneous designs

Design
enablement

Rich Eco-System of
High-Performance IP

Advanced process
technology

Advanced
packaging

Economies of scale & scope
built on flexible business models combine with platform
to create integrated solutions

Spec

Design & Integration

FAB

Assembly & Test

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