Skip to content

EDS Process

  • mail
EDS Process
[Electrical Die Sorting] A process to check integrated circuit chips formed on a wafer function properly. EDS stands for Electrical Die Sorting, and is an inspection process to check individual chips on a near-completed wafer to verify each chip function properly. The EDS process comprises five major steps; 1. ET Test & WBI (Electrical Test & Wafer Burn In); 2. Pre-Laser; 3. Laser Repair & Post Laser; 4. Tape Laminate & Back Grinding; and 5. Inking. Electrical testing is the first step, and checks whether each chip has reached the prescribed quality levels. At each inspection step, chips that fail the inspection are sorted into two categories. Repairable chips are sent to be repaired, and chips beyond repair are marked (inked) and omitted from subsequent processes. The EDS process is an important first step in the semiconductor process wherein defective chips are sorted from good ones.
Related contents
Related Contents

Would you like to
leave this page? If you leave this page, the content you are creating
will not be saved.

Back Leave

Registration Are you sure you want to submit this?

Back
Thank you! Please confirm your registration

Your subscription is not active yet!
An email with an activation link
has just been sent to your email address.
Please activate your subscription by clicking on
the activation link inside the email.

Confirm
Thank you! Please confirm

your existing registration

You have already registered, but before we can send you the
information about upcoming events, we need your confirmation.

If you missed our previous email, please use the button below to resend it.
To activate your subscription, please click on the link included in the email.

Resend
Alert

To proceed, please click on the "check" button located in the email section.

Confirm