Samsung Brings 3DIC Ecosystem, Multi-Die Integration Alliance, and 3DCODE
In an environment where Moore’s Law is slowing down, the 3DIC ecosystem has become particularly crucial since the industry needs to prepare for the next phase of its evolution. Samsung has identified 3DICs as the future of semiconductor products like networking, HPC, and even mobile applications.
As such, the company announced at SFF 2023 the Multi-Die Integration Alliance — which allows members to enable the facilitation of 2.5D and 3D package designs for customers. The alliance features multiple partners from a wide variety of areas, extending from Foundry, EDA, IP, DSP, and package to test, memory, and substrate. These key partners are now collaborating on fan-out packaging2, which is already in use for mobile applications, and I-Cube3, which Samsung is developing for HPC. Going a step further, X-Cube4 will soon be available for a wide range of different applications, moving from simple to complicated integration.
The 3DCODE standard, which is a system description language intended to simplify the definition and interoperability of design creation and analysis flows in a unified environment, was also announced at the event. This new standard ensures better experiences for designers creating advanced packaging technologies.