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Innovation is Alive. Samsung Semiconductor at CES 2018

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At this year’s CES at Las Vegas, Samsung Semiconductor exhibited its latest solutions and products that include mobile processors, mobile memory solutions, image sensors, server memory solutions, high-speed memory solutions and security solutions. In addition to showcasing its innovations, Samsung also shared its view and offerings for the top industry trending categories; IoT and automotive. Mobile The first solution presented at the mobile section is the CES 2018 Innovation Awards HONOREE, the brand new Exynos 9 Series 9810 mobile processor. The Exynos 9810, built on the second generation 10nm FinFET process for amazing power efficiency, is Samsung’s latest flagship processor with a 3rd generation custom CPU core that nearly doubles the single core performance of its predecessor. In addition, the processor introduces sophisticated features to enhance user experience with deep learning-based software. For an always on and seamless mobile experience, Exynos 9810 is embedded with an LTE modem that supports category 18 with 6CA (Carrier Aggregation) for blazing fast downlink speeds of up to 1.2Gbps. The upgraded MFC supports hardware accelerated decoding and encoding for videos in truly realistic colors with 10-bit HEVC (H.265), H.264 and VP9 codecs.
Samsung Semiconductor's mobile booth with Exynos 9 Series 9810 at CES 2018
Samsung Semiconductor's mobile booth with Exynos 9 Series 9810 at CES 2018
As the world leader in advanced memory technology, Samsung’s portfolio of the latest mobile memory guarantees a solution for any power budget and performance class. The latest member of the mobile DRAM portfolio--the LPDDR4X 8GB POP with 10nm-class 16Gb LPDDR4X—joined the exhibit, boasting 30% better power efficiency over its predecessor LPDDR4. The highest-capacity MCP was also introduced at the scene. The GX128.48 uMCP incorporates two leading-edge process technologies—4th gen V-NAND UFS and 10nm-class 16Gb LPDDR4X—to provide increased capacity while reducing footprint. Samsung showcased its continuous development of mobile storage solutions with the world’s first UFS v3.0 interface product, which is to debut in Q1 2018, as well as an UFS v2.1 interface product which boasts the highest density in the eStorage market at 512GB. Vast advancements in image sensors have spurred the replacement of point-and-shoot cameras with smartphones in recent years, with near DSLR-level image quality. Another CES 2018 Innovation Awards HONOREE, the Samsung ISOCELL Slim 2X7 image sensor is the epitome of these advancements. It is a 24 megapixel image sensor that uses the industry’s smallest 0.9μm sized pixel. With 0.9um sized pixels, a high resolution 24Mp image sensor and its camera module can be built in a much smaller form to fit in a very slim smartphone. In addition, the sensor also takes advantage of Tetrapixel, a technology that merges four neighboring pixels to work as one to increase light sensitivity to take brighter and sharper pictures even in a low-lit environment. Server and High-speed Memory Solutions For server memory solutions, 256GB 3DS DDR4 DIMM (16Gb Comp.), the industry’s first highest standard DIMM, was accompanied by the line-up of client SSDs and enterprise SSDs with both NVMe and SATA interfaces, including the CES 2018 Innovation Awards HONOREE PM983—the first 8 terabyte “next-generation small form factor (NGSFF)”—which can deliver I/O at a phenomenal 0.5 petabytes in a 1U rack per second while improving space utilization and scaling options in hyper-scale datacenter servers. 16Gb GDDR6 Graphic DRAM and HBM2 Aquabolt™ were introduced as high-speed memory solutions. GDDR6 Graphic DRAM, another 2018 Innovation Awards HONOREE from Samsung, is the fastest and largest density Graphic DRAM for advanced graphics processing for gaming devices and graphics cards as well as automotive, network and artificial intelligence systems with data transfers of 16 gigabits per second (Gbps), which represents a more than two-fold increase over 8Gb GDDR5 with its 8Gbps pin speed. HBM2 Aquabolt™ delivers a 2.4 gigabits-per-second (Gbps) data transfer speed per pin with 1024 I/O, making it ideal for high-performance applications, such as for use in next-generation supercomputers, AI solutions and graphics systems, with these improvements, a single Samsung 8GB HBM2 package will offer a 307 gigabytes-per-second (GB/s) data bandwidth.
Samsung Semiconductor's Server - Memory Solutions booth at CES 2018; A man is wearing a VR headset
Samsung Semiconductor's Server - Memory Solutions booth at CES 2018; A man is wearing a VR headset
IoT The IoT technology is helping our homes and appliances stay connected to make our lives more efficient and enjoyable. At the IoT section, Samsung presented and demoed various smart and secure IoT solutions for connected homes. The section started with an introduction and a showcase of a module with Exynos i T200, an IoT-dedicated processor with Wi-Fi and strong security. Samsung demonstrated a smart speaker reference platform that not only recognizes a user’s voice but also their face for highly personalized virtual assistant services. To address security and privacy in IoT, Samsung demoed authentication, secure storage, key management, and crypto-operation using the EAL 5+ CC certified IoT SE (Security Element) with PUF (Physical Unclonable Function) technology. Automotive It’s not just our homes, but even cars are also getting a make-over with new infotainment systems that bring new styles of entertainment and various viewing-sensors for autonomous driving. Samsung Semiconductor’s automotive solutions for infotainment, autonomous driving, and telematics were at full display. An automotive processor that supports multiple OS and multi-display for safe driving assistant and entertainment, an image sensor with high frame rate for accurate front sensing, and various automotive memory products were just a few of the automotive products on display. Samsung demonstrated WDR, which is a critical feature in automotive cameras because of its influence in object detecting performance in high contrast light conditions such as when entering or exiting tunnels or parking structures. As an integrated device manufacturer, Samsung assured its end-to-end controllability including dedicated fabrication lines, in-house solutions, and more. At CES 2018, Samsung Semiconductor exhibited large portfolios of products and solutions that will surely be a catalyst for innovations in various applications including mobile, server, IoT, automotive, and more. * Technological term of 'Tetrapixel' was updated in July 2022

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