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KHBAC4A03C-MC1HT

With greater bandwidth comes
greater possibility
With greater bandwidth comes
greater possibility
With greater bandwidth comes
greater possibility

Meet the chip designed to supercharge data centers, lighten loads for high-performance computing, and tap AI’s full potential.
With 12 stacks of startlingly fast DRAM, HBM3 Icebolt is high-bandwidth memory at its fastest, most efficient, and highest capacity.
Built to go beyond today’s standards, so you can take on tomorrow’s challenges.
Meet the chip designed to supercharge data centers, lighten loads for high-performance computing, and tap AI’s full potential. With 12 stacks of startlingly fast DRAM, HBM3 Icebolt is high-bandwidth memory at its fastest, most efficient, and highest capacity. Built to go beyond today’s standards, so you can take on tomorrow’s challenges. Meet the chip designed to supercharge data centers, lighten loads for high-performance computing, and tap AI’s full potential. With 12 stacks of startlingly fast DRAM, HBM3 Icebolt is high-bandwidth memory at its fastest, most efficient, and highest capacity. Built to go beyond today’s standards, so you can take on tomorrow’s challenges.

Specification

  • DensityDensity
    16 Gb
  • OrganizationOrganization
    1024
  • SpeedSpeed
    6.4 Gbps
  • RefreshRefresh
    32 ms
  • PackagePackage
    MPGA
  • Production StatusProduct Status
    Mass Production

* All product specifications reflect internal test results and are subject to variations by user’s system configuration.
* All product images shown are for illustration purposes only and may not be an exact representation of the product.
* Samsung reserves the right to change product images and specifications at any time without notice.