Dr. Lee joined Samsung the DRAM Design Team and became an expert in DRAM technology. He participated in the development of various DRAM products, most notably DDR, DDR2, DDR3, GDDR, LPDDR2, LPDDR3.

In 2011, he was elevated to VP and Head of the Design Team for his contribution to the advancement of DRAM technology. Additionally, his business acumen was instrumental in strategically productizing and gaining market acceptance of Samsung's most advanced technologies such as 3D-NAND and HBM (High Bandwidth Memory)

during his tenure as Senior VP in the Product Planning Team from 2013 to 2017.

Other roles Dr. Lee has fulfilled are Executive VP of Quality Assurance Department of Memory Business and later become in charge of DRAM Product and Technology Development prior to being promoted to President and General Manager of Memory Business.

He received his B.S., M.S., and Ph.D. degrees in electronics engineering from Seoul National University.

Since joining Samsung Electronics in 2014 as a vice president of the next-generation product development team, he has been responsible for the development of next-generation products like touch controller ICs and wearable bio-processors.

He has led R&D for image sensors and LSI products, such as display solutions, power ICs, and security solutions from 2015 to 2018.

As an executive vice president of the sensor business team since 2019, he led R&D and commercialization of advanced pixel technology and high-resolution sensors, such as the first 108MP CMOS image sensor.

In 2020, he strengthened the strategic direction of the entire System LSI Business as an executive vice president and head of product planning, sales & marketing.

With the development of diverse innovative solutions, he is driving the growth of Samsung’s System LSI Business.

Before Samsung, he had been president, chief executive officer and a member of board of directors at Dongbu Hitek since 2009.

Before joining Dongbu, he held key technology management positions at Texas Instruments from 1999 to 2007 and was analog group leader at LG Electronics from 1987 to 1999.

Mr. Park received B.S. and M.S. degrees in electrical engineering from Yonsei University in 1987 and 1993 respectively.

Prior to his current position, Dr. Choi successfully led establishing the world's largest semiconductor manufacturing cluster serving as the head of Manufacturing Technology Center since 2017. He also spearheaded the innovation of manufacturing system to greatly strengthen fab operation efficiency as well as maximize technology competitiveness.

Since joining Samsung Electronics in 1995, Dr. Choi has played a pivotal role in developing next-generation process technologies across memory and logic ICs that strengthened Samsung's leading position in the semiconductor market. Under his leadership, Samsung successfully

launched industry's first SoCs based on 14 and 10nm FinFET process technologies.

Dr. Choi has published more than 100 technical papers in top academic journals, and holds more than 100 U.S. patents. He also has been serving as a member of numeral technical committees including VLSI, ITRS, and IMEC.

Dr. Choi received his B.S. and M.S in Materials Science and Engineering from Yonsei University in 1986 and 1988 respectively, and his Ph.D. in Materials Science and Engineering from Ohio State University in 1994.