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Samsung CXL® Memory
Solutions
Samsung CXL® Memory
Solutions
Samsung CXL® Memory Solutions

Revolutionize your data center's memory capabilities with Samsung's cutting-edge CXL® solutions. Leveraging the power of CXL®, an open standard interface that establishes high-speed, low-latency1 connections between processors and devices, Samsung offers innovative products designed to expand memory capacity and memory bandwidth beyond traditional DDR channels.

  • Capacity
    Expansion

    Up to 50%2 higher
    total memory capacity
    compared to RDIMM only

  • Bandwidth
    Expansion

    Up to 100%2 greater
    total memory bandwidth
    compared to RDIMM only

  • Memory
    Pooling

    Maximize memory utilization
    across multiple hosts

1 Similar to the latency of 1 NUMA hop.
2 Memory capacity & bandwidth values based on 16 DDR5 memory DIMM slots and 64 CXL® lanes.
CMM-D CMM-D CMM-D

CMM-D is a CXL® Memory Module built with Samsung's DRAM technology. CMM-D allows for easy and efficient scaling of memory as needed. This maximizes performance for data-intensive workloads, and ensures it can adapt to future computing demands. 

Samsung CMM-D with its black casing lifted, exposing the precision-engineered circuit board and memory chips.
The Samsung CXL Memory Module DRAM with its slim black design.
What is Compute
Express Link (CXL®)?
What is Compute
Express Link (CXL®)?
What is Compute Express Link (CXL®)?

An open standard developed through the CXL® Consortium,
CXL® is a high-speed, low-latency CPU-to-device interconnect technology built on the PCIe physical layer. CXL® provides efficient connectivity between the host CPU and connected devices such as accelerators and memory expansion devices.

Samsung Develops Industry's First CXL®
DRAM Supporting
CXL 2.0
Samsung Develops Industry's First CXL® DRAM Supporting CXL 2.0 Samsung Develops Industry's First CXL® DRAM Supporting CXL 2.0

128GB DRAM based on advanced CXL® 2.0 interface to accelerate commercialization of next-generation memory solutions.

Samsung CXL Memory Module DRAM with the black ridged casing offset to reveal the internal circuit board and memory chips.
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