Our footprints toward low carbon emissions

In October 2019, Samsung Semiconductor launched the “UFS 3.0 (512GB)” and became the first among global memory semiconductor manufacturers to receive carbon footprint certification. The “UFS 3.0 (512GB)” is the first semiconductor product where the Carbon Trust has certified its eco-friendly manufacturing results. Even more impressive, the “UFS 3.0 (512GB)” was achieved the CO₂ measured PCF label and Water measured PWF (Product Water Footprint) label at the same time.

The “UFS 3.0 (512GB)” is a high-performance 5th generation (9x layer) 512Gb (gigabit) V-NAND-based product. When compared to the previous 4th generation 64-layer 256Gb V-NAND-based 256GB product, its capacity has been doubled, its data transmission speed has been increased by 2.1 times, and its operating voltage has been lowered by 33% to provide superior speed, power saving abilities, and productivity at the same time. A single process (1 Etching Step) that increases the number of cell stacking layers by approximately 1.5 times and pierces more than 90 layers at once, has been applied to the 5th generation 512Gb V-NAND, and the chip size has been reduced by more than 25% compared to the previous 4th generation V-NAND, in order to minimize carbon emissions and water consumption.

The Carbon Trust awards the reducing CO₂ label certification to newly-launched products when they can prove that they emit less carbon dioxide than their predecessors. The “UFS 3.1 (512GB)”, which is the follow-up product of the “UFS 3.0 (512GB)” which was previously awarded carbon footprint certification, is the memory semiconductors product to obtain the reducing CO₂ label thanks to the efforts put in to reduce carbon emissions during the development and manufacturing processes of the product.

The “UFS 3.1 (512 GB)” emits less carbon dioxide than the previous “UFS 3.0 (512 GB)” model, and its “continuous write speed” is approximately three times faster, too.

As a high-performance mobile processor used in premium smartphones, the Exynos 2100 is optimized for high-spec gaming and complicated multitasking. By applying cutting-edge 5nm processes and the latest CPU/GPU design technology, it has achieved unmatched performance and low power. At the same time, it can perform up to 26 trillion artificial intelligence calculations per second.

The HM2 Camera Image Sensor Chip is a product that has greatly expanded the 100 million-pixel image sensor market for smartphones. The HM2 Camera Image Sensor Chip is a 108 million-pixel mobile image sensor that uses 0.7 μm pixels. The height of the camera module can be decreased by up to 10% by reducing the size of the image sensor by up to 15% compared to devices using 0.8 μm pixels.  This image sensor utilizes the non-pixel structure that combines 9 pixels into one. It not only brings ultra-high resolution to life but also creates clean images in low-light conditions.

The S6HD820 (Quantum Processor 8K III) decompresses compressed digital data received from broadcasting or the Internet into broadcasting video data, then processes the resolution and audio to deliver it to screens and speakers. This product is equipped with a network processing unit (NPU) to optimize 8K high-resolution and audio based on artificial intelligence, and integrates the previously separate high-resolution upscaling IC into one chip to achieve low power efficiency. The upscaling IC is a semiconductor that converts low-resolution images into high-resolution images. It converts 2K or 4K videos into 8K.

The S6TST21 (QUANTUM PROCESSOR 8K III) converts video data received from the DTV SoC into the time and data required by the DDI (Display Driver IC), then delivers it. This product reduces power consumption by not only integrating two chips that were used in previous 8K TVs into one, but also by applying advanced processes.