Power Management System/
Supply,
Battery Management System
Integrated Center Stack,
Instrument Cluster,
Telematics, IVI Domain Controller
Camera Module, Radar Module, LIDAR & Laser Module, V2X,
ADAS Domain Controller
Engine Management System, Motor Controller, Battery Management System,
Zonal Controller
To bring the next-level of driving experience to life,
Samsung Foundry is mass-producing IVI solutions for customers using 14nm, 8nm, and
5nm process technologies.
For enhanced power solutions, Samsung Foundry is manufacturing a specialized 8-inch PMIC product wafer.
As with IVI solutions, Samsung Foundry is manufacturing 14nm, 8nm, and 5nm products. Furthermore, we plan to expand auto grade support from AG2 to AG1 for select processes, like 8nm and 5nm. We’re
also developing more advanced nodes for ADAS products requiring higher processing performance, like 4nm and
2nm. With these solutions, we are ready to enable customers to lead the future of autonomous driving.
Samsung Foundry is enabling MCU customers with 28nm embedded non-volatile memory (eNVM) technologies (embedded Flash and embedded MRAM). In addition, a FinFET-based eMRAM will
be offered.
Building on an extensive track record,
Samsung Foundry continues to refine a comprehensive, innovation-based
roadmap
that will define the future of mobility.
These plans include technologies that will
perform both at a higher level and at increasing efficiency, thanks to
the development of advanced technologies for our automotive processes.
For auto grade processes, Samsung Foundry already offers 14nm Logic chips and 28nm eFlash eNVM chips at AG1, and SF5A and 8nm Logic chips at AG2. In the coming years, we expect to bring SF4A and even SF2A chips to the market. Furthermore, we will complete 14/8/5nm eMRAM process development.
| Process | Available | 2023 | 2024 | 2025 | 2026 |
|---|---|---|---|---|---|
| Logic | |||||
| SF2A | |||||
| SF4A | |||||
| SF5A | SF5A | ||||
| 8nm | 8nm | ||||
| 14nm | |||||
| eNVM | |||||
| 8nm eMRAM | |||||
| 14nm eMRAM | |||||
|
28nm eFlash |
Auto, G2 Auto, G1 | ||||
Power management is a key aspect of contemporary automotive solutions.
To this end, Samsung Foundry provides BCD
Power IC in 130nm 1.5 / 3.3 / 5 / 7’’ 70V / eFlash. There are also plans to release 130nm 100V BCD, 90nm 70V BCD, and +DTI in the coming years.
For eFlash, we will soon offer 1.2V, ESF3.
|
Available Now |
2023 | 2024 | 2025 | |
|---|---|---|---|---|
|
BCD Power IC |
||||
|
130nm 1.5/ 3.3/ 5/ 7~70V/ eFlash |
130nm 100V BCD |
+DTI | ||
| 90nm 70V BCD | ||||
| eFlash | ||||
| eFlash (1.2V, ESF3) | Auto, G1 | |||
Customers are prepared for the future with Samsung Foundry’s automotive IP and design infrastructure. In addition to dedicated programs for automotive customers, we provide a 14nm process that supports AG1 as well as 8nm & 5nm processes that support AG2. Our offerings go beyond interface IPs with analog and security IPs for these processes as well. For chiplet solutions, D2D IPs like UCIe are being developed in 8nm and 5nm.
Kick off your next generation automotive design with Samsung Foundry’s strong technical foundation; design in confidence with IP covering Analog, Memory Interface, High-Speed Interface, and Security;
in addition, automotive-hardened IP-ready support for 14nm AG1, 8LPU AG2, and SF5A AG2. Design infrastructure readiness is now available for 14nm, 8nm, and SF5A Technology, Design Collateral, and
Foundation IPs. For enhanced quality and reliability, we offer AEC-Q100-aware sign-off, DFT & Zero DPPM as well as advanced functional safety
for design methodology.
Samsung Foundry provides automotive solutions certified for high quality, reliability, safety, and security. To ensure high quality, Wafer-Level Reliability and AEC-Q100 Grade 1 for IP/
Packaging with Auto Grade
2/1 are available.
For quality management, our auto service package is IATF 16949-certified by ASP Automotive, ensuring a high standard of excellence.
We’ve earned the ISO 26262 functional safety
standard and are ASIL-B assessment ready.
And for security, we offer complete and configurable IPs for all EVITA security levels.
Wafer Level Reliability
AEC-Q100 Grade 1,
IP/Packaging Grade 2/1 available
ISO26262 functional safety ASIL-B assessment ready
IATF 16949 certified
ASP ensuring automotive quality
Complete and configurable IP
for all EVITA security levels
Reliability in even
the most challenging temperatures
Immunity shielding to enable
consistent performance
Durability to last for 15+ years
under demanding conditions
Robust packaging is essential in the harsh environments of automotive ICs. Our innovative packaging technology overcomes the challenges of thermal extremes, electromagnetic interference, and constant vibration over the expected 15-year life of a vehicle.
WLP
Grade 3
FOWLP
Grade 3
WB-FBGA
Grade 3
FC-FBGA
Grade 3
FC-PBGA
Grade 3
MCM
Grade 3
We support numerous automotive package types including wafer-level packaging (WLP/FOWLP), ball-grid-array packaging (FBGA, PBGA,FC-FBGA, FC-PBGA), lead-frame packaging, and module packaging.
Through partnerships with key industry leaders,
Samsung Foundry’s automotive IP has earned
ASIL & AEC-Q100 qualifications.
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