More chips are better as one,Advanced Heterogeneous Integration
Advanced Heterogeneous Integration brings the best of today’s chips to bear in one unified system – bringing power and diversity for a chipset that’s deeply efficient, highly adaptable, and simpler for production.
I-Cube™ deploys parallel horizontal chip placement to boost performance while combating heat build-up. Samsung’s Through Silicon Via ( TSV ) and Backend-of-the-line ( BEOL ) technologies form a foundation for two or more chips to harmonize their specialized functions, becoming more than the sum of their parts to deliver powerful solutions for modern devices. I-Cube™ is available in I-CubeS™ and I-CubeE™ derivatives based on the interposer type.Learn more
3D IC packages boost performance even further by using much shorter interconnect wire lengths by stacking components vertically, enabling ultra-high vertical interconnect density with lower parasitics while saving massive amounts of on-chip real estate. 3D IC: X-Cube™ technology dramatically reduces yield risks from large monolithic dies, with 3D Integration that enables high system performance with lower cost while retaining high bandwidth and low power.Learn more
3D IC: X-Cube™
Build your way with end-to-end packaging solutions
Your products are as unique as the chips that power them. Samsung Foundry delivers precision at every stage of the chip making process. With end-to-end solutions, it brings your chip design to life from design to fabrication and packaging, and all the way to testing.Learn more
Rich Eco-System of
Design & Integration
Assembly & Test
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