Samsung’s advanced heterogeneous chip packages empower today’s device manufacturers to pursue tomorrow’s breakthroughs. With bleeding-edge 2.5D and 3D variations, Samsung combines chips, process nodes, and cutting edge tech to open all new possibilities.
Breakthroughs in AI, 5G, autonomous vehicles and Metaverse
tech promise to reshape the way we live – but delivering the
function and performance needed to power those advancements
on a single chip is becoming more complex, and less cost
Samsung’s Advanced Heterogeneous Integration (HIT) brings chips, process nodes, and bleeding edge technologies together in one unified package – increasing density and combining powerful functions, all while bringing down costs.
In a future powered by HBM and advanced computing, AHI is empowering device manufacturers to explore new technologies that push the limits of performance in their products. See below to learn more about Samsung’s I-CUBE, H-CUBE and X-CUBE solutions.
2.5D packages deploy parallel horizontal chip placement to
combat heat build-up and expand on performance.
Samsung’s Through Silicon Via (TSV) and Backend-of-the-line (BEOL) technologies form a bedrock for two or more chips to harmonize their specialized functions, becoming more than the sum of their parts to deliver powerful solutions for modern devices.
3D IC packages save massive amounts of on-chip real estate by stacking components vertically, reducing surface area and bumping performance by shortening the space between chips. By dramatically reducing the risks from big die construction, they keep costs low while retaining high bandwidth and low power performance.