Skip to content

Wafer

  • mail
Wafer The key material used to create semiconductor integrated circuits. A thin and round sheet made by slicing a monocrystalline ingot obtained by growing silicon (Si), gallium arsenide (GaAs), and other materials. ※ Wafer parts and names
웨이퍼1
웨이퍼1

① Chip: The thin and small piece on the wafer where the electrical circuits are embedded. The IC chip. ② Scribe Line: The border between the chip without any electrical circuits. Lines to separate each chip on the wafer. ③ TEG (Test Element Group): A chip to test whether it works or not. ④ Edge Die: The damaged part. A bigger wafer has less damage than a wafer with a smaller diameter, which also reduces the loss factor. ⑤ Flat Zone: The flat part to distinguish the round wafer structure.
Related contents
Related Contents

Would you like to
leave this page? If you leave this page, the content you are creating
will not be saved.

Back Leave

Registration Are you sure you want to submit this?

Back
Thank you! Please confirm your registration

Your subscription is not active yet!
An email with an activation link
has just been sent to your email address.
Please activate your subscription by clicking on
the activation link inside the email.

Confirm
Thank you! Please confirm

your existing registration

You have already registered, but before we can send you the
information about upcoming events, we need your confirmation.

If you missed our previous email, please use the button below to resend it.
To activate your subscription, please click on the link included in the email.

Resend
Alert

To proceed, please click on the "check" button located in the email section.

Confirm