Skip to content

Samsung Advanced Packaging Helps Customers Bring Their Own Architecture

BYOB? BYOA! How Samsung Semiconductor’s Advanced Package business helps customers move beyond Moore’s Law through heterogeneous integration.

  • mail
As the semiconductor industry moves beyond Moore's Law, Samsung Semiconductor is ready to support customers with design infrastructure, chiplets, multi-die fabrication, substrate sourcing, and more. Just bring us your designs, ideas, or architecture, and we will take care of the rest. Using advanced heterogeneous integration to merge logic and memory semiconductors together in 2.5D and 3D packages that are higher performance and more power efficient at a lower cost than traditional monolithically designed chips, Samsung Semiconductor's Advanced Package (AVP) technologies include: I-Cube A 2.5D package, I-Cube brings incredible speed and heat performance together through parallel horizontal chip integration across a single layer of logic and a stacked layer of memory semiconductors. Using Samsung’s Through Silicon Via (TSV) and Backend-of-the-Line (BEOL) technologies, I-Cube allow multiple chips to harmonize their special functions for increased efficiency. Based on the interposer type, I-Cube is available in I-CubeS and I-CubeE derivatives.
X-Cube In a 3-D package, performance is boosted by stacking components vertically, enabling shorter interconnect wire lengths compared to conventional packaging and saving a huge amount of on-chip real estate. X-Cube technology marries high system performance with lower costs, as well as high bandwidth and low power, while dramatically reducing yield risks from larger monolithic dies.
Ready to Bring Your Own Architecture beyond Moore's Law? Find out more about Samsung Semiconductor’s Advanced Package business.
Related contents
Related Contents
Related Fabrication Process
Go to Fabrication Process
Related Dictionary
Go to Dictionary

Would you like to
leave this page? If you leave this page, the content you are creating
will not be saved.

Back Leave

Registration Are you sure you want to submit this?

Back
Thank you! Please confirm your registration

Your subscription is not active yet!
An email with an activation link
has just been sent to your email address.
Please activate your subscription by clicking on
the activation link inside the email.

Confirm
Thank you! Please confirm

your existing registration

You have already registered, but before we can send you the
information about upcoming events, we need your confirmation.

If you missed our previous email, please use the button below to resend it.
To activate your subscription, please click on the link included in the email.

Resend
Alert

To proceed, please click on the "check" button located in the email section.

Confirm