Total Design Platform in Collaboration with Ecosystem Partners
Finding lasting solutions in any technical field requires more than just one-off technology advancements. It requires complete support. On that account, Samsung Foundry has developed a total design platform to meet the growing needs of its customers. Samsung's Total Design Platform embeds the best-known methodologies and IPs combined with process and package solutions. It offers collaborative insights from our Samsung Advanced Foundry Ecosystem (SAFE) partners in mobile, automotive, and HPC/AI, who develop design infrastructures with Samsung. The benefits of Samsung’s design platform can be best explained in the real-world advantages it provides.
In mobile applications, to save power and area, we provide a customized flip-flop and SRAM that lowers Vmin to below 0.5V. In addition, we also provide machine learning based P&R solutions.
For the automotive sector, our qualified IP and design solutions are offered as a safety measure to prevent failure while driving. This includes IP for real-time monitoring of frequency, power, and temperature along with advanced DFT solutions. In practice, this reliable implementation enabled one product to run 24 hours a day for 10 years.
Finally, for HPC, Samsung provides high performance infrastructure such as uLVT cell, UHS SRAM, and 6.4Gbps HBM3 interface. By leveraging 32Gbps D2D interface, it's possible to implement two logic dies and eight HBM.
SAFE has been growing year after year with new partners joining our open ecosystem. We are currently engaged with 22 EDA partners, 9 DSP partners, 10 OSAT partners, 9 cloud partners, plus, 56 IP partners who provide more than 4,000 IP titles.
This is only the beginning of what’s possible with GAA and multi-die integration solutions. With the support of Samsung’s ecosystem partners, Samsung Foundry will continue striving to offer the best possible support for our customer´s success by expanding our design infrastructure to meet ever-growing needs in the semiconductor industry.