In the rapidly evolving landscape of semiconductor technology, the pursuit of greater performance, efficiency, and functionality drives innovation at every turn. One of the most exciting advancements in this realm is multi-die integration, a technique that allows for the combination of multiple chips into a single package, effectively enhancing capabilities and optimizing system performance. Innovative 2.5D and 3D packaging has become the solution to extending the future of “More than Moore”. At the forefront of this transformation is 3DCODE, a revolutionary tool designed to address the unique challenges associated with multi-die integration. But why exactly should you consider using 3DCODE for this complex and demanding process?

Enter 3DCODE, a highly optimized description language that stands out as a powerful solution tailored to the intricacies of multi-die integration. Its advanced features streamline the design, testing, and validation of interconnected semiconductor dies, ensuring that they function harmoniously within a unified system. By leveraging 3DCODE, engineers and designers can achieve higher levels of precision, reduce time-to-market, and minimize the risks associated with multi-die integration.

3DCODE uses a two-level hierarchy to operate the 3D integrated circuit (3DIC) platform. Its syntax has three basic components: a) 3dTop defines the virtual top's netlist; b) 3dBlock contains each die’s design information; and c) 3dBuilder contains the die-to-die and die-to-package information. 

When building a 3DIC, the following sequence of events must occur: 1) 3dTop calls 3dBuilder and 3dBlock; 2) 3dBuilder calls the die and package instances based on the 3dBlock files; and 3) finally, 3dBuilder connects each instance and builds the MDI structure.

For detailed information about syntax and variables, download the whitepaper below.

From its robust design tools to its comprehensive testing capabilities, 3DCODE is not just a choice but a necessity for pushing the boundaries of semiconductor technology and achieving next-level performance. 3DCODE increases multi-die design efficiency, primarily through the expansion of the search space, which allows users to choose from a variety of MDI designs. 

The description language also brings uniformity across chip design and implementation with JSON (JavaScript Object Notation), providing seamless integration and multi-tool compatibility. More importantly, the use of a single language on one platform simplifies communication across different stages of the design process. 

3DCODE aids the performance and automation of early-level design through script-based design of experiment (DoE). This allows users to easily generate various physical MDI structures on the electronic design automation (EDA) MDI platform. These structures are then connected to analysis tools within the platform, and since all work is done on one platform through scripts, users' DoE turnaround time (TAT) is significantly reduced.

With early analysis flow for thermal and static IR, designers can create many test cases for 3DIC design in the early design stage. This helps to identify potential issues early and enhance performance & reliability, which significantly contributes to lowering both TAT and costs.

3DCODE provides comprehensive support for all design processes from planning to post-analysis. During design setup, the platform collects and verifies design implementation information, creating a simple 3D view of the design for early thermal analysis. 

Moving forward, a more efficient thermal analysis method will be implemented with 3DCODE. 

For post-analysis, 3DCODE will be used to perform design-rule checking (DRC) and layout versus schematic (LVS) checking.