The Stack Method

The Stack Method A technique in which the level of integration is increased by stacking cells vertically on the semiconductor chip. As the semiconductor capacity increased, integrating cells only horizontally on the semiconductor’s surface did not physically allow for more cells, which is how this method came about. There is the stack method, where cells are stacked on top of each other, and there is also the trench method, in which a higher level of integration is achieved by stacking the cells underneath. The stacking method, which stacks new layers on the wafer’s surface, is easier and more economical compared to the trench method. Furthermore, it is more efficient, as we can check the internal circuits to solve any malfunctions in a product.