MCP (Multi Chip Package)

MCP (Multi Chip Package) A semiconductor that consists of several semiconductor chips in a package. MCP stands for multi-chip package, and the technology stacks 2 or more semiconductor chips to make one package. In other words, it looks like only one semiconductor to the eye, but it contains several chips inside. It is the same logic as stacking a burger patty, cheese, vegetables, and other fillings in a burger to make it easier for people to eat. An MCP (multi-chip package), unlike installing several separate semiconductors horizontally, stacks them vertically, which minimizes the space used by the chips. As we can add many features in a limited space with an MCP, it is necessary for devices like smartphones, tablet PCs, and other portable electronic devices. However, the international standard for one chip’s maximum volume is 1.4mm, which is why incorporating different technologies to make each chip as thin as possible is the key.