Samsung Calls for Developmental Collaboration to Usher in a New Era of Data

Samsung Electronics, a world leader in advanced semi

The memory industry has long focused its efforts on satisfying demand for larger capacities and faster speeds, as well as higher bandwidth. However, in order to keep up with growing demand, the industry will need to look beyond individual innovations and assess the bigger picture. Samsung is committed to collaborating with the industry in this area and intends to lead the development of next-generation solutions. The massive and ongoing rise in data has exposed a need for revolutionary change in memory computation and subsystems. In response, Samsung has been leading the development of technologies that can be used to give existing system architectures a much-needed update, including HBM-PIM, AXDIMM, Smart SSDs and CXL-based DRAM. Having been the first in the memory industry to utilize EUV and HKMG process technology, Samsung is uniquely positioned to introduce in a new era of powerful memory innovations. The company has been optimizing thermal performance by advancing innovations like Hybrid Copper Bonding (HCB), while its V-NAND technologies continue to redefine how memory is stacked.

“I believe our industry will rise to this challenge not by innovating independently, but by finding solutions together,” said Han. “Going forward, we’ll develop a new IT ecosystem together that is much more powerful and sustainable, one which will be needed to architect the digital future.” Click on the video below to watch the keynote.